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| SS8046 3.3V 2A Low-Dropout Regulator with Disable Features Dropout-voltage 0.5V @ I O = 2A Output current in excess of 2A Output voltage accuracy 2.5% Quiescent current typically 5mA Internal short-circuit current limit Internal over-temperature protection TO-220 4pin Full-Mold package ON/OFF control General Description The SS8046 positive 3.3V voltage regulator features the ability to source 2A of output current. The dropout voltage is 0.5V at 2A output current. The typical quiescent current is 5mA. Furthermore, the quiescent current is smaller when the regulator is in the dropout mode (V IN < 3.3V). Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent the device from being damaged by abnormal operating conditions. A Vdis pin is provided to disable the output when needed. Ordering Information SS8046XX1TB Packing type TB: Tubes Package Type TF : TO 220F-4L (short lead) TH : TO 220F-4L (long lead) Example: SS8046TF1TB a SS8046 in TO 220F-4L (short lead) shipped in tubes Typical Application Pin Configuration ON/OFF IO V IN C1 4.7F TO 220F-4 V OUT C OUT 47F SS8046 IQ Top View V IN V O GND V dis 1 2 3 4 Rev.2.01 6/06/2003 www.SiliconStandard.com 1 of 7 SS8046 Block Diagram VIN 1 THERMAL SHUTDOWN SHORT-CIRCUIT PROTECTION 2 VO BANDGAP REFERENCE 1.25V _ + R1 HIGH / LOW Vdis 4 OUTPUT ON/OFF TTL COMPATIBLE BUFFER R2 3 GND Absolute Maximum Ratings (Note 1) Input Voltage.............................................................................................8V Vdis Voltage...............................................................................................8V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature...................................................................150C Storage Temperature Range..........................................................................-65C TJ +150C Lead Temperature, Time for Wave Soldering TO 220 Package.......................................................................................260C, 10s Continuous Power Dissipation (TA = +25C) TO 220 No heatsink...................................................................................1.5W TO 220 with infinite heatsink........................................................................15W Operating Conditions (Note 1) Input Voltage..........................................................................................3.6V~7V Temperature Range..................................................................................-20C TA 85C Rev.2.01 6/06/2003 www.SiliconStandard.com 2 of 7 SS8046 Electrical Characteristics VIN =5V, IO = 0.5A, CIN = 4.7F, COUT =47F, TA = TJ = 25C unless otherwise specified [Note 3] PARAMETER Output Voltage Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature Disable Voltage High Disable Voltage Low Disable Bias Current High Disable Bias Current Low V disH V disL IdisH IdisL Output Active Output Disabled V dis = 2.7V V dis = 0.4V 2.0 0.8 20 20 SYMBOL IO =0.5A CONDITIONS 4V < V IN < 7V, IO = 10mA 50mA < IO < 2A V IN = 5V fi = 120Hz, 1VP-P, IO = 100mA IO = 2A MIN 3.22 TYP 3.3 0.5 0.5 5 45 MAX 3.38 2 2 10 0.5 UNITS V % % mA dB V A C V V A A 3.8 150 Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / JA. If this dissipation is exceeded, the die temperature will rise above 150C and the device will go into thermal shutdown. For the TO 220 package, JA is 60C/W (No heat sink). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The output capacitor should be a tantalum or aluminum type. Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly a ffected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by u sing pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Rev.2.01 6/06/2003 www.SiliconStandard.com 3 of 7 SS8046 Typical Performance Characteristics (V IN=5V, CIN=10F, COUT =47F, TA=25C, unless otherwise noted.) Line Transient Response Load Transient Response Short Circuit-Current Output Noise Ripple Rejection 60 Disable- ON IL=100mA 50 Ripple Rejection (dB) 40 30 IL=2A 20 IL=1A 10 COUT=47F 0 10 100 1000 10000 100000 1000000 Frequency (Hz) Rev.2.01 6/06/2003 www.SiliconStandard.com 4 of 7 SS8046 Typical Performance Characteristics (continued) Dropout Voltage vs. Temperature 0.5 Load Regulation 0 -0.1 -0.2 IL=2A 0.4 IL=100mA~1A 4V 7V Load Regulation (%) -40 -20 0 20 40 60 80 100 Dropout Voltage (V) -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 0.3 0.2 0.1 0 -1 -40 -20 0 20 40 60 80 100 Temperature (C) Temperature (C) Output Voltage vs. Temperature 3.5 3.45 3.4 3.35 Quiescent Current vs. Temperature 5 4.5 4 VIN=4V VIN=5V VIN=6V IL=1A VIN=5V Quiescent current (mA) 100 VIN=7V 3.5 3 2.5 2 1.5 1 0.5 Vout 3.3 3.25 3.2 3.15 3.1 -40 -20 0 20 40 60 80 0 -40 -20 0 20 40 60 80 100 Temperature (C) Temperature (C) Rev.2.01 6/06/2003 www.SiliconStandard.com 5 of 7 SS8046 Package Outlines E1 4.8 3.75 b D e 2.8 0.15 3 .20 E A A1 TO 220F-4 Package (short lead) Note: 1. Lead frame material: TAMAC-4 2. Solder plating thickness: 105m 3. Package body size include mold flash and gate burr 4. Tolerance0.1mm unless otherwise specified 5. End flash Max. 0.05mm 6. Mismatch Max. 0.05mm 7. Misalignment Max. 0.05mm 8. Epoxy molding compound: SUMITOMO 6300H or equivalent 9. Matte finish Ra: 0.2m~0.8m top and bottom surface SYMBOL A A1 A2 D E E1 C e b ? MIN. 4.42 2.69 1.68 10.00 6.25 8.54 ------------4 DIMENSION IN MM NOM. 4.57 2.79 1.78 10.10 6.35 8.64 0.48 2.54(TYP) 0.635(TYP) 7 MAX. 4.72 2.89 1.88 10.20 6.45 8.74 ------------11 Rev.2.01 6/06/2003 www.SiliconStandard.com C A2 MIN. 0.174 0.106 0.066 0.400 0.246 0.336 ------------4 DIMENSION IN INCH NOM. 0.180 0.110 0.070 0.404 0.250 0.340 0.019 0.1(TYP) 0.025(TYP) 7 MAX. 0.186 0.114 0.074 0.408 0.254 0.344 ------------11 6 of 7 SS8046 2.8 0.15 E1 L b D e 3 .20 E A A1 TO 220F-4 Package (long lead) Note: 1. Lead frame material: TAMAC-4 2. Solder plating thickness: 105m 3. Package body size include mold flash and gate burr 4. Tolerance0.1mm unless otherwise specified 5. End flash Max. 0.05mm 6. Mismatch Max. 0.05mm 7. Misalignment Max. 0.05mm 8. Epoxy molding compound: SUMITOMO 6300H or equivalent 9. Matte finish Ra: 0.2m~0.8m top and bottom surface SYMBOL A A1 A2 D E E1 L C e b ? MIN. 4.42 2.69 1.68 10.00 6.25 8.54 13.70 ------------4 DIMENSION IN MM NOM. 4.57 2.79 1.78 10.10 6.35 8.64 13.90 0.48 2.54(TYP) 0.635(TYP) 7 MAX. 4.72 2.89 1.88 10.20 6.45 8.74 14.10 ------------11 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. Rev.2.01 6/06/2003 www.SiliconStandard.com C A2 MIN. 0.174 0.106 0.066 0.400 0.246 0.336 0.539 ------------4 DIMENSION IN INCH NOM. 0.180 0.110 0.070 0.404 0.250 0.340 0.547 0.019 0.1(TYP) 0.025(TYP) 7 MAX. 0.186 0.114 0.074 0.408 0.254 0.344 0.555 ------------11 7 of 7 |
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