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| Datasheet File OCR Text: |
| PROCESS Small Signal Transistors CP353V NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter 1 Bonding Pad Area Emitter 2 Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 3,878 PRINCIPAL DEVICE TYPES CZT853 EPITAXIAL PLANAR 66 x 66 MILS 7.1 MILS 7.9 x 7.9 MILS 7.9 x 9.5 MILS 7.9 x 9.5 MILS Al-Si - 30,000A Ti/Ni/Ag - 2,000A/3,000A/20,000A R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CP353V Typical Electrical Characteristics R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m |
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