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 2.5V Drive Pch+SBD MOSFET
ES6U42
Structure Silicon P-channel MOSFET / Schottky barrier diode Dimensions (Unit : mm)
WEMT6
(6) (5) (4)
Features 1) Pch MOSFET and schottky barrier diode are put in WEMT6 package. 2) High-speed switching, Low On-resistance. 3) Low voltage drive (2.5V drive). 4) Built-in Low VF schottky barrier diode. Applications Switching
(1)
(2)
(3)
Abbreviated symbol : U42
Package specifications
Package Type ES6U42 Code Basic ordering unit (pieces) Taping T2R 8000
Inner circuit
(6) (5) (4)
2
(1)Gate (2)Source (3)Anode (4)Cathode (5)Drain (6)Drain
1 (1) 1 ESD protection diode 2 Body diode (2) (3)
Absolute maximum ratings (Ta=25C)
Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Channel temperature Power dissipation
1 Pw10s, Duty cycle1% 2 Mounted on a ceramic board
Continuous Pulsed Continuous Pulsed
Symbol VDSS VGSS ID IDP 1 IS ISP 1 Tch PD
2
Limits -20 12 1.0 4.0 -0.4 -4.0 150 0.7
Unit V V A A A A C W / ELEMENT
Parameter Repetitive peak reverse voltage Reverse voltage Forward current Forward current surge peak Junction temperature Power dissipation
1 60Hz 1cycle 2 Mounted on a ceramic board
Symbol VRM VR IF IFSM Tj PD
1
Limits 25 20 0.5 2.0 150 0.5
Unit V V A A C W / ELEMENT
2
Parameter Power dissipation Range of storage temperature
Mounted on a ceramic board
Symbol PD Tstg
Limits 0.8 -55 to +150
Unit W / TOTAL C
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1/5
2009.01 - Rev.A
ES6U42
Electrical characteristics (Ta=25C)
Parameter Symbol Min. IGSS Gate-source leakage - Drain-source breakdown voltage V(BR) DSS -20 Zero gate voltage drain current IDSS - Gate threshold voltage VGS (th) -0.7 - Static drain-source on-state RDS (on) - resistance - Forward transfer admittance Yfs 0.7 Input capacitance Ciss - Output capacitance Coss - Reverse transfer capacitance Crss - Turn-on delay time td (on) - Rise time tr - Turn-off delay time td (off) - Fall time tf - Total gate charge Qg - Gate-source charge Qgs - Gate-drain charge Qgd -
Pulsed
Data Sheet
Typ. - - - - 280 310 570 - 150 20 20 9 8 25 10 2.1 0.5 0.5
Max. 10 - -1 -2.0 390 430 800 - - - - - - - - - - -
Unit A V A V m m m S pF pF pF ns ns ns ns nC nC nC
Conditions VGS= 12V, VDS=0V ID= -1mA, VGS=0V VDS= -20V, VGS=0V VDS= -10V, ID= -1mA ID= -1A, VGS= -4.5V ID= -1A, VGS= -4V ID= -0.5A, VGS= -2.5V VDS= -10V, ID= -0.5A VDS= -10V VGS= 0V f= 1MHz VDD -15V VGS= -4.5V ID= -0.5A RL 30 RG= 10 VDD -15V, VGS= -4.5V ID= -1A, RL 15 RG= 10
Parameter Symbol Min. Forward voltage
Pulsed
Typ. -
Max. -1.2
VSD
-
Unit V
Conditions IS= -1.0A, VGS=0V
Parameter Forward voltage Reverse current Symbol VF IR Min. - - - Typ. - - - Max. 0.36 0.52 100 Unit V V A IF= 0.1A IF= 0.5A VR= 20V Conditions
www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved.
2/5
2009.01 - Rev.A
ES6U42
Electrical characteristics curves
2.0 Ta=25C Pulsed 2.0
VGS= -10V VGS= -4.5V VGS= -4.0V VGS= -3.0V
Data Sheet
DRAIN CURRENT : -ID[A]
DRAIN CURRENT : -ID[A]
1.5
1.5
DRAIN CURRENT : -ID[A]
VGS= -10V VGS= -4.0V VGS= -3.0V
Ta=25C Pulsed
10
VDS= -10V Pulsed Ta= 125C Ta= 75C Ta= 25C Ta= - 25C
1
VGS= -2.4V
1.0
1.0
VGS= -2.5V VGS= -2.2V VGS= -2.0V
0.1
VGS= -2.2V
0.5
0.5
0.01
VGS= -2.0V
0.0 0.0 2.0 4.0 6.0 8.0 10.0 0.001 1.0
0.0 0.0 0.2 0.4 0.6 0.8 1.0
1.5
2.0
2.5
DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.1 Typical Output Characteristics()
DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.2 Typical Output Characteristics()
GATE-SOURCE VOLTAGE : -VGS[V] Fig.3 Typical Transfer Characteristics
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
10000
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
1000
VGS= -2.5V VGS= -4.0V VGS= -4.5V
Ta=125C Ta=75C Ta=25C Ta= -25C
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
Ta=25C Pulsed
10000
VGS= -4.5V Pulsed
10000
VGS= -4V Pulsed
Ta=125C Ta=75C Ta=25C Ta= -25C
1000
1000
100 0.01 0.1 1 10
100 0.01 0.1 1 10
100 0.01 0.1 1 10
DRAIN-CURRENT : -ID[A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current()
DRAIN-CURRENT : -ID[A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current()
DRAIN-CURRENT : -ID[A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current()
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
10000
Ta=125C Ta=75C Ta=25C Ta= -25C
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
REVERSE DRAIN CURRENT : -Is [A]
VGS= -2.5V Pulsed
10 VDS= -10V Pulsed
10 VGS=0V Pulsed 1 Ta=125C Ta=75C Ta=25C Ta=-25C
1 Ta= -25C Ta=25C Ta=75C Ta=125C
1000
0
0.1
100 0.01 0.1 1 10 DRAIN-CURRENT : -ID[A] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current()
0 0.01 0.1 1 10 DRAIN-CURRENT : -ID[A] Fig.8 Forward Transfer Admittance vs. Drain Current
0.01 0.2
0.4
0.6
0.8
1.0
1.2
SOURCE-DRAIN VOLTAGE : -VSD [V] Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage
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3/5
2009.01 - Rev.A
ES6U42
1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m] 900 800 700 600 500 400 300 200 100 0 2 4 6 8 10 12 GATE-SOURCE VOLTAGE : -VGS[V] Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage 1 0.01 0.1 1 10 DRAIN-CURRENT : -ID[A] Fig.11 Switching Characteristics ID= -1.0A ID= -0.5A SWITCHING TIME : t [ns] Ta=25C Pulsed 10000 Ta=25C VDD= -15V VGS=-4.5V RG=10 Pulsed 5 GATE-SOURCE VOLTAGE : -VGS [V] 4
Data Sheet
1000 tf 100 td(off)
3 2
10 tr td(on)
1 0 0 0.5 1 1.5
Ta=25C VDD= -15V ID= -1.0A RG=10 Pulsed 2 2.5
TOTAL GATE CHARGE : Qg [nC] Fig.12 Dynamic Input Characteristics
1000 Ciss CAPACITANCE : C [pF] 100
Crss 10 Coss Ta=25C f=1MHz VGS=0V 0.01 0.1 1 10 100
1
DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.13 Typical Capacitance vs. Drain-Source Voltage

100000 REVERSE CURRENT: IR [uA] 10000 1000 100 10 1 0.1 0.01 0 5 10 15 20 25 REVERSE VOLTAGE : VR [V] Fig.1 Reverse Current vs. Reverse Voltage Ta= - 25 Ta = 75 Ta = 25 pulsed FORWARD CURRENT : IF(A) 1 pulsed
0.1 Ta = 75 Ta = 25 0.01 Ta= - 25
0.001 0 0.1 0.2 0.3 0.4 0.5 0.6 FORWARD VOLTAGE : VF(V) Fig.2 Forward Current vs. Forward Voltage
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4/5
2009.01 - Rev.A
ES6U42
Measurement circuit
Pulse Width
Data Sheet
ID VGS RL D.U.T. RG VDD
VDS
VGS
10% 50% 10%
90%
50%
10% 90% td(off) toff tf
VDS td(on)
90% tr ton
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
ID VGS IG(Const.) D.U.T. RL
VDS
VGS Qgs
Qg
Qgd
RG
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
FIg.2-2 Gate Charge Waveform
Notice 1. SBD has a large reverse leak current compared to other type of diode. Therefore; it would raise a junction temperature, and increase a reverse power loss. Further rise of inside temperature would cause a thermal runaway. This built-in SBD has low VF characteristics and therefore, higher leak current. Please consider enough the surrounding temperature, generating heat of MOSFET and the reverse current. 2. This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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5/5
2009.01 - Rev.A
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office.
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Appendix-Rev4.0


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