doc. no : qw0905- rev. : a date : 23 - may - 2007 LVY13433-PF data sheet super bright oval type led lamps LVY13433-PF ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 60 75% radiation angle(0.5):h 34 degree/v 18 degree 25% 75%50%25% 0 50%100% vertical axis 18 -30 30 horizontal axis 34 0 LVY13433-PF package dimensions part no. ligitek electronics co.,ltd. property of ligitek only page 1/5 25.0min 0.5 typ + - 1.0min 2.54typ 1.5max 7.4 5.0 4.31
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 75 -40 ~ +100 -40 ~ +85 ir 2000 10 ratings vy 60 30 mw v a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LVY13433-PF LVY13433-PF yellow algainp 590 water clear vertical axis 18 horizontal axis 34 1500 900 1.7 202.6 spectral halfwidth nm dominant wave length dnm emitted material part no lens color luminous intensity @20ma(mcd) forward voltage @20ma(v) viewing angle 2 1/2 (deg) typ. max. min.min.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page 3/5 part no. LVY13433-PF
page 4/5 ligitek electronics co.,ltd. property of ligitek only dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile 150 260 c3sec max 5 /sec max 260 120 100 2 /sec max 50 25 0 0 preheat 60 seconds max time(sec) temp( c) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. LVY13433-PF
page 5/5 ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. test item operating life test reliability test: high temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test low temperature storage test thermal shock test solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition part no. LVY13433-PF
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