doc. no : qw0905- rev. : date : 29 - aug.- 2007 LHYSGL2092 a data sheet ligitek electronics co.,ltd. property of ligitek only dual color led lamps LHYSGL2092 pb lead-free parts
18.0min 2.0min 25% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -60 100% 25% 50% 75% 0 directivity radiation -30 0 2.54typ 2.54typ 2.0min 60 50%75%100% 30 1.anode green 2.common cathode 3.anode yellow ligitek electronics co.,ltd. property of ligitek only LHYSGL2092 part no. 5.2 6.7 0.5 4.2 0.5 typ 1 2 3 1.5 max 4.0 3.0 package dimensions 1/6 page hy sgl 3 1 2
ligitek electronics co.,ltd. property of ligitek only unit hy ratings mw ma a v 60 75 10 2000 30 ma page 2/6 -40 ~ +100 -40 ~ +85 parameter power dissipation peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) forward current storage temperature operating temperature absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. tstg i f t opr ir pd i fp symbol esd * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. LHYSGL2092 part no. forward voltage @20ma(v) luminous intensity @20ma(mcd) lens white diffused LHYSGL2092 green aigainp yellow part nomaterial emitted color 50530--- 595151.7 120 65 3.560 300 160 ---60 dominant wave length dnm spectral halfwidth nm min. viewing angle 2 1/2 (deg) typ. min. typ. -20 ~ +80 -30 ~ +100 30 500 50 120 100 sgl ingan/sic 502 --- peak wave length pnm max. 4.2 2.6
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500 550 600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 hy chip page3/6 LHYSGL2092 part no.
350400450500 650 0.2 0.4 0.8 55 50 45 35 ambient temperature ta( ) r e l a t i v e l u m i n o u s i n t e n s i t y ( a . u . ) 25 20 15 5 3.5 2.5 15 4/6 page sgl chip part no. 1.5 1.0 0.5 0.0 2.0 60 70 65 40 2530 10 0 100 80 4.0 3.0 2.0 1.0 0.6 0.0 600 550 40 30 20 60 40 20 0 1.5 1.0 0.5 0.0 10 0 25 20 10 5 0 1.5 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve fig.4 relative intensity vs. ambient temp f o r w a r d c u r r e n t ( m a ) wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature ta( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. ambient temp LHYSGL2092
60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max part no. LHYSGL2092
page 6/6 ligitek electronics co.,ltd. property of ligitek only reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item description reference standard mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. part no. LHYSGL2092
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