released process tqtrx gaas mesfet foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 1 of 7; rev 1.0 11/15/01 tqtrx process cross-section production process TQRLC advanced passives foundry service features ? thick 4 layer meta l; > 9 m total thickness ? high density interconnects: ? 3 global ? 1 local ? high-q passives; inductor q >50 @ 2 ghz ? low cost: passives only ? thin film resistors ? dielectric encapsulated metals ? planarized surface; simplified plastic packaging ? volume production process applications ? passive components: ? phase shifters ? baluns ? transformers ? couplers ? mixers (with off-chip di- ode arrays) ? circuits requiring high-q passive elements ? matching circuits ? rf module front-end filters ? general rf and microwave imped- ance matching general description triquint?s TQRLC is a pure passives process. it is targeted at high performance, small size passive-only circuits and utilizes over 9 m of gold metal. high density interconnections are ac- complished with three thick global and one surface metal inter- connect layers. the four metal laye rs are encapsulated in a high performance, low dielectric consta nt material that allows wiring flexibility and plastic packaging si mplicity. precision nicr resis- tors, inductors, and high value mim capacitors are available. the process is based on the tqtrx process, currently triquint?s highest volume proc ess. the TQRLC process is available on 150-mm (6 inch) wafers. semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 1 of 3; rev 2.3 3/18/04 TQRLC process cross-section
released process tqtrx mesfet foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 2 of 7; rev 1.0 11/15/01 specifications subject to change capacitor breakdown voltage 40 v maximum ratings production process TQRLC advanced passives foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 2 of 3; rev 2.3 3/18/04 element parameter value units interconnects metal layers four: 0.4,2,2,5.5 m space width met3= 5; met1&2= 3 m trace width met3= 5; met1&2= 2 m bcb dielectric nom. thickness ild1= 1 +/-0.1; ild2&3= 3.2 +/- 0.2 m dielectric constant 2.8 mim caps values 600 pf/mm2 resistors nicr 50+/-3 ohms/sq vias no mask layers no vias 10 TQRLC process details met3 via3 met2 via2 via1 met1 met0 mim ild3 dielectric ild2 dielectric ild1 dielectric passivation example of metal stack configurations possible with TQRLC process; edge? or parallel-coupled structures through the ild layers are also possible.
design tool status ? design manual available now ? device library of circuit elements includes thin film resistors, capacitors, inductors ? agilent ads definition file for e-m simulation now ? layout/verification kit for iceditors ? cadence layout library available now process qualification status ? TQRLC is a fully-released process ? reliability reports ? TQRLC process qualification ? tqtrx element qualification report ? for more information on quality and reliability, contact triquint or visit: www.tqs.com/manufacturing/qr/bdy_qr-pubs.htm. production process TQRLC advanced passives foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 3 of 3; rev 2.3 3/18/04 applications support services ? tiling of gdsii stream files including pcm ? design rule check services ? layout versus schematic check services ? engineering services: ? packaging development ? test development engineering (on-wafer and packaged parts) ? thermal analysis engineering ? yield enhancement engineering ? part qualification services ? failure analysis manufacturing services ? mask making ? production 150 mm wafer fab ? wafer thinning ? wafer sawing ? dc die sort testing ? rf on-wafer testing ? plastic packaging ? rf packaged part testing please contact your loca l triquint semiconductor representative or foundry services staff for additional information: e-mail: sales@triquint.com phone: (5 03) 615-9000 fax: (503) 615-8905 prototyping and development ? prototype development quickturn (pdq): ? shared mask set; ? run monthly; ? hot lot cycle time; ? prototype wafer option (pwo): ? customer-specific masks, customer schedule ? 2 wafers delivered ? with thinning and sawing training ? gaas design classes: ? half day introduction; upon request ? four day technical training; fall & spring at triquint oregon facility ? for training schedule s, please visit: www.triquint.com/foundry/
|
