2006, 2008 the mark shows major revised points. the revised points can be easily s earched by copying an "" in the pdf file and specifying it in the "find what:" field. description the pg2164t5n is a gaas mmic dpdt (d ouble p ole d ouble t hrow) switch which was developed for 2.4 ghz and 6 ghz dual-band wireless lan. this device can oper ate frequency from 2.4 ghz band and 6 ghz band, having the low insertion loss and high isolation. this device is housed in a 6-pin plastic tson (t hin s mall o ut-line n on-leaded) package. and this package is able to high-density surface mounting. features ? operating frequency : f = 2.4 to 2.5 ghz and 4.9 to 6.0 ghz ? switch control voltage : v cont (h) = 2.8 to 5.0 v (3.0 v typ.) : v cont (l) = ? 0.3 to 0.3 v (0 v typ.) ? low insertion loss : l ins 1 = 0.50 db typ. @ f = 2.4 to 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : l ins 2 = 0.70 db typ. @ f = 4.9 to 6.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? high isolation : isl1 = 25 db typ. @ f = 2.4 to 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : isl2 = 17 db typ. @ f = 4.9 to 6.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? handling power : p in (1 db) = +31.0 dbm typ. @ f = 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : p in (1 db) = +29.0 dbm typ. @ f = 6.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? high-density surface mounting : 6-pin plastic tson package (1.5 1.5 0.37 mm) application ? dual-band wireless lan (ieee802.11a + b/g) ordering information part number order number package marking supplying form pg2164t5n-e2 pg2164t5n-e2-a 6-pin plastic tson (pb-free) g5b ? embossed tape 8 mm wide ? pin 1, 6 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evaluation samples, contact your nearby sales office. part number for sample order: pg2164t5n data sheet caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. dpdt switch for 2.4 ghz and 6 ghz dual-band wireless lan gaas integrated circuit pg2164t5n document no. pg10636ej02v0ds (2nd edition) date published february 2008 ns printed in japan
pin connections and in ternal block diagram pin no. pin name 1 ant2 2 v cont 2 3 out2 (rx) 4 out1 (tx) 5 v cont 1 (top view) (top view) 6 5 4 1 2 3 g5b 1 2 3 6 5 4 (bottom view) 1 2 3 6 5 4 6 ant1 remark exposed pad : gnd truth table v cont 1 v cont 2 ant1 ? out1 (tx) ant1 ? out2 (rx) ant2 ? out1 (tx) ant2 ? out2 (rx) high low off on on off low high on off off on absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit switch control voltage v cont ? 6.0 to +6.0 v input power p in +32 dbm operating ambient temperature t a ? 45 to +85 c storage temperature t stg ? 55 to +135 c recommended operating range (t a = +25 c, unless otherwise specified) parameter symbol min. typ. max. unit switch control voltage (h) v cont (h) 2.8 3.0 5.0 v switch control voltage (l) v cont (l) ? 0.3 0 0.3 v operating frequency 1 f1 2.4 ? 2.5 ghz operating frequency 2 f2 4.9 ? 6.0 ghz data sheet pg10636ej02v0ds 2 pg2164t5n
electrical characteristics (t a = +25 c, v cont (h) = 3.0 v, v cont (l) = 0 v, z 0 = 50 , dc blocking capacitors = 4 pf, unless otherwise specified) parameter symbol test conditions min. typ. max. unit insertion loss 1 l ins 1 f = 2.4 to 2.5 ghz ? 0.50 0.75 db insertion loss 2 l ins 2 f = 4.9 to 6.0 ghz ? 0.70 1.00 db isolation 1 (ant to out) isl1 f = 2.4 to 2.5 ghz 22 25 ? db isolation 2 (ant to out) isl2 f = 4.9 to 6.0 ghz 14 17 ? db isolation 3 (ant1 to ant2, tx to rx) isl3 f = 2.4 to 2.5 ghz 22 25 ? db isolation 4 (ant1 to ant2, tx to rx) isl4 f = 4.9 to 6.0 ghz 15 17 ? db input return loss 1 rl in 1 f = 2.4 to 2.5 ghz ? 15 ? db input return loss 2 rl in 2 f = 4.9 to 6.0 ghz ? 15 ? db output return loss 1 rl out 1 f = 2.4 to 2.5 ghz ? 15 ? db output return loss 2 rl out 2 f = 4.9 to 6.0 ghz ? 15 ? db 1 db loss compression input power 1 note p in (1 db) 1 f = 2.4 to 2.5 ghz ? +31.0 ? dbm 1 db loss compression input power 2 note p in (1 db) 2 f = 4.9 to 6.0 ghz ? +29.0 ? dbm input 3rd order intercept point iip 3 f1 = 2 500 mhz, f2 = 2 501 mhz, p in (1 tone) = +20 dbm ? +50 ? dbm switch control current i cont ? 0.1 1.0 a switch control speed t sw 50% ctl to 90/10% ? 50 ? ns note p in (1 db) is measured the input power leve l when the insertion loss increases more 1 db than that of linear range. caution this device is used it is necessary to use dc bl ocking capacitors. data sheet pg10636ej02v0ds 3 pg2164t5n
evaluation circuit v cont 2 out1 (tx) 6 5 4 1 2 3 out2 (rx) v cont 1 1 000 pf ant1 1 000 pf 4 pf 4 pf 4 pf ant2 4 pf the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. data sheet pg10636ej02v0ds 4 pg2164t5n
mounting pad and solder mask layout dimensions 6-pin plastic tson (unit: mm) 0.3 0.5 0.3 0.2 0.3 0.5 0.5 mounting pad 0.3 1.0 solder mask 0.475 0.25 0.475 0.15 0.25 0.5 0.5 0.35 0.55 solder thickness : 0.08 mm remark the mounting pad and solder mask layouts in this document are for reference only. data sheet pg10636ej02v0ds 5 pg2164t5n
package dimensions 6-pin plastic tson (unit: mm) 0.50.06 0.20.1 0.70.1 (bottom view) (top view) 1.50.1 1.50.1 0.37 +0.03 ?0.05 0.2 +0.07 ?0.05 0.30.07 (side view) 1.20.1 data sheet pg10636ej02v0ds 6 pg2164t5n
recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperatur e (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering met hods together (except for partial heating). data sheet pg10636ej02v0ds 7 pg2164t5n
the information in this document is current as of february, 2008. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific": data sheet pg10636ej02v0ds 8 pg2164t5n
caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. ? do not burn, destroy, cut, crush, or chemically di ssolve the product. ? do not lick the product or in any way allow it to enter the mouth. pg2164t5n
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