september 2008 rev 1 1/8 8 smtyf low forward voltage tvs transky? features high peak pulse power: ? 600 w (10/1000 s) ? 4000 w (8/20 s) stand-off voltage 5 or 12 v low forward voltage: 0.48 v @ 0.85 a @ 25 c low clamping factor v cl /v br fast response time very thin package (1.0 mm overall component height) ecopack2 ? halogen-free package complies with the following standards: iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883e- method 3015-7: class 3c ? human body model description the transky is designed specifically for portable equipment and miniaturized electronic devices subject to esd transient overvoltages. the transky combines the performance of a transil? or tvs (transient voltage supressor) and low forward voltage schottky diode in a monolithic structure. tm : transky is a trademark of stmicroelectronics. tm : transil is a trademark of stmicroelectronics. k a unidirectional smaflat ka www.st.com
characteristics smtyf 2/8 1 characteristics table 1. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v pp iec 61000-4-2 standard air discharge contact discharge 15 8 kv p pp peak pulse power dissipation (1) t j initial = t amb 600 w i fsm non repetitive surge peak forward current t p = 10 ms t j = t initial = t amb 25 a t stg storage temperature range -65 to +175 c t j operating junction temperature range -40 to +175 c 1. 10/1000 s pulse waveform table 2. thermal resistance symbol parameter value unit r th(j-l) junction to leads 20 c/w table 3. electrical characteristics - parameters (t amb = 25 c) symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic resistance i pp peak pulse current c capacitance i i f v f v cl v br v rm i pp i rm v i r table 4. electrical characteristics - values (t amb = 25 c) type v f max (i f = 0.85 a) i rm max@v rm v br @i r (1) v cl @i pp 10/1000 s r d (2) 10/1000 s v cl @i pp 8/20 s r d (2) 8/20 s t (3) 25 c 85 c min typ max max max max va (max)v vmava va 10-4/c smtyf5.0a 0.48 10 500 5 6.40 6.74 7.07 10 9.2 68 0.029 13.4 298 0.021 5.7 smtyf12a 0.48 20 1200 12 13.2 13.7 14.3 1 18.5 31 0.129 22.9 157 0.055 7.8 1. pulse test: t p <50ms. 2. to calculate maximum clamping voltage at other surge currents, use the following formula v clmax = r d x i pp + v brmax 3. to calculate v br versus junction temperature, use the following formula: v br @ t j = v br @ 25 c x (1 + t x (t j - 25))
smtyf characteristics 3/8 figure 1. definition of ipp pulse 100 50 %i pp t r t p 0 t repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s) figure 2. relative peak power dissipation versus initial junction temperature figure 3. peak pulse power versus exponential pulse duration (t j initial = 25 c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 175 200 p pp [t j initial] / p pp [t j initial=25c] initial (c) t j p (kw) pp 0.1 1.0 10.0 100.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 t j initial = 25 c t (ms) p
characteristics smtyf 4/8 figure 4. clamping voltage versus peak pulse current (exponential waveform, maximum values) i pp (a) 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 5 10152025 t j initial=25 c smtyf5.0a tp = 8/20 s tp = 10/1000 s tp = 8/20 s tp = 10/1000 s smtyf12a v cl (v) figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. forward voltage drop versus forward current (typical values) c(pf) 1.e+02 1.e+03 1.e+04 1 10 100 f=1 mhz v osc =30 mv rms t j =25 c smtyf5.0a smtyf12a v (v) r i (a) fm 1.e-02 1.e-01 1.e+00 1.e+01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t j =25 c t j =85 c v (v) fm
smtyf characteristics 5/8 figure 7. average power dissipation versus ambient temperature figure 8. relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board fr4, s cu = 1 cm 2 ) figure 9. thermal resistance junction to ambient versus copper surface under each lead (printed circuit board fr4, copper thickness = 35 m) figure 10. leakage current versus junction temperature (typical values) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 25 50 75 100 125 150 175 p(w) r th(j-a) =r th(j-l) r th(j-a) =200 c/w (pcb fr4, recommended pad layout) t amb (c) z th(j-a) /r th(j-a) 0.00 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 on recommended pad layout t (s) p r th(j-a) (c/w) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 s (cm ) cu 2 i (a) r 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 25 50 75 100 125 150 175 v r =v rm smtyf5.0a smtyf12a t (c) j
package information smtyf 6/8 2 package information case: jedec do-221ac molded plastic over planar junction terminals: solder plated, solderable per mil-std-750, method 2026 polarity: band indicates cathode flammability: epoxy rated ul94v-0 rohs package in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com . table 5. smaflat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.95 0.088 0.116 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 l1 0.50 0.019 l2 0.50 0.019 figure 11. smaflat footprint dimensions optimized for smaflat (1) 1. sma footprint may also be used. figure 12. marking information d a l 2x l l2 2x l1 2x e e1 b c 1.20 (0.047) 1.20 (0.047) 3.12 (0.123) 5.52 (0.217) 1.52 (0.060) millimeters (inches) y w w e3 z x x x e3: ecopack ( leadfree) xxx: marking z: manufacturing location y: year ww: week cathode bar ( unidirectional devices only )
smtyf ordering information 7/8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode smtyf5.0a yf5.0 smaflat 0.035 g 10 000 tape and reel smtyf12a yf12 table 7. document revision history date revision description of changes 04-sep-2008 1 first issue
smtyf 8/8 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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