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omnidirectional microphone with bottom port and analog output admp401 rev. b information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trade marks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 - 9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ? 2010 analog devices, inc. all rights reserved. features 4.72 mm 3.76 mm 1.0 mm surface - mount package high snr of 62 dba s ensitivity of ? 42 dbv flat frequency response from 100 hz to 1 5 khz low current consumption of <25 0 a single - ended analog output high psrr of 7 0 db compatible with sn/pb and pb - free solder processes rohs /weee compliant applications smart p hones and feature phones teleconferencing systems digital video c ameras bluetooth h eadsets video phones tablets general description the admp401 is a high quality, high performance , low power , an alog output , bottom - ported omnidirectional mems microphone. the admp401 consists of a mems microphone element , an impedance converter, and an output amplifier. the admp401 sensitivity specification mak es it an excellent choice for both near field and far f ield applications. the admp401 has a high snr and flat wideband frequency response , resulting in natural sound with high intelligibility. low current consumption enables long battery life for portable applications. a built - in particle filter provides for h igh reliability. the admp401 complies with the tia - 920 standard , telecommunications telephone terminal equipment transmission requirements for wideband digital wireline telephones . the admp401 is available in a thin , 4.72 mm 3.76 mm 1.0 mm surface - moun t package. it is reflow solder compatible with no sensitivity degradation . the admp401 is halide free . functional block dia gram asic v dd output gnd mems membrane backplate 07712-001 impedance converter output amplifier admp401 figure 1.
admp401 rev. b | page 2 of 12 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 general description ......................................................................... 1 functional block diagram .............................................................. 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 esd caution .................................................................................. 4 pin configuration and function descriptions ............................. 5 prin ted circuit board (pcb) land pattern layout ...................... 6 typical performance characteristics ............................................. 7 applications information .................................................................8 connecting the admp401 to a codec ......................................8 connecting the admp401 to an op amp gain stage ............8 handling instructions .......................................................................9 pick - and - place equipment ..........................................................9 reflow solder .................................................................................9 board wash ....................................................................................9 reliability specifications ................................................................ 10 outline dimensions ....................................................................... 11 ordering guide .......................................................................... 11 revision hi story 12/10 rev. a to rev. b changes to applications and general description sections ...... 1 changes to table 1 ............................................................................ 3 8 /10 rev . 0 to rev. a changes to frequency response parameter, table 1 ................... 3 changes to supply voltage parameter, table 2 ............................. 4 changes to applications information section, figure 9 , and figure 10 ............................................................................................ 8 updated outline dimensions ....................................................... 11 4/ 10 revision 0 : initial versi on
admp401 rev. b | page 3 of 12 specifications t a = 25c, v dd = 1.8 v , unless otherwise noted. all min imum and maximum specifications are guaranteed. typical specifications are not guaranteed. table 1 . parameter symbol test conditions /comments min typ max unit performance directionality omni sensitivity 1 khz, 94 db spl ?45 ? 42 ?39 dbv signal -to - noise ratio snr 62 dba equivalent input noise ein 32 dba spl dynamic range derived from ein and maximum acoustic input 88 db frequency response 1 low frequency, ?3 db point 10 0 hz high frequency, ?3 db point 15 khz deviation limits from flat response within pass band ? 3/+2 db total harmonic distortion thd 105 db spl 3 % power supply rejection ratio psrr 217 hz, 100 mv p - p square wave superimposed on v dd = 1.8 v 70 db maximum acoustic input peak 120 db spl power supply supply voltage v dd 1.5 3. 3 v supply current i s 250 a output characteristics output impedance z out 200 output dc offset 0.8 v output current limit 90 a 1 see figure 6 and figure 7 .
admp401 rev. b | page 4 of 12 absolute maximum ratings table 2. parameter rating supply voltage ?0.3 v to + 3.6 v sound pressure level ( spl) 160 db mechanical shock 1 0,000 g vibration per mil - std -883 m ethod 2007, test condition b temperature range ? 40c to + 70c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exp osure to absolute maximum rating conditions for extended periods may affect device reliability. esd caution 07712-002 t p t l t 25c t o peak t s prehe at critica l zone t l t o t p tempera ture time ramp-down ramp-up t smin t smax t p t l figure 2. recommended soldering profile limits table 3 . recommended soldering profile l imits profile feature sn63/pb37 pb - free average ramp rate (t l to t p ) 3c/s ec max imum 3c/s ec max imum preheat minimum temperature (t smin ) 100c 150c maximum temperature (t smax ) 150c 200c time ( t smin to t smax ), t s 60 s ec to 120 s ec 60 s ec to 120 s ec ramp - up rate (t smax to t l ) 3c/s ec max imum 3c/s ec max imum time maintained above liquidous ( t l ) 60 sec to 150 sec 60 sec to 150 sec liquidous temperature ( t l ) 183c 217c peak temperature ( t p ) 240c + 0c/ ?5c 260c + 0c/ ?5c time w ithin 5c of actual peak temperature ( t p ) 10 s ec to 30 s ec 20 s ec to 40 s ec ramp - down rate 6c/s ec max imum 6c/s ec max imum time 25c to peak temperature 6 min ute max imum 8 min ute max imum
admp401 rev. b | page 5 of 12 pin configuration an d function description s 07712-003 bottom view (terminal side down) not to scale gnd output gnd v dd gnd gnd 3 1 2 4 5 6 figure 3. pin configuration (bottom view) table 4. pin function descriptions pin no. mnemonic description 1 output analog output signal 2 gnd ground 3 gnd ground 4 gnd ground 5 v dd power supply 6 gnd ground
admp401 rev. b | page 6 of 12 printed circuit b oard (pcb) land pattern layout the recommended pcb land pattern for the admp401 should have a 1:1 ratio to the solder pads on the microphone package, as shown in figure 4 . care s hould be taken to avoid applying solder paste to the sound hole in the pcb. a suggested solder paste stencil pattern layout is shown in figure 5 . the diameter of the sound hole in the pcb should be larger than the diameter of th e sound port of the microphone. a minimum diameter of 0.5 mm is recommended. 2.62 ?1.10 ?1.68 ?0.70 (2) ?0.90 (3) 2.40 1.20 2.54 0.79 1.27 07712-004 figure 4 . pcb land pattern layout (dimensions shown in mm) 1.27mm 1.2mm 2.54mm 2.62mm 3.41mm 2.4mm 0.85mm dia. (3) 1.8mm/1.3mm dia. 0.2032 cut width (4) 0.649mm dia. (2) 07712-005 figure 5 . suggested solder paste stencil pattern layout
admp401 rev. b | page 7 of 12 ty pical performance ch aracteristics ?10 ?8 ?6 ?4 ?2 0 2 4 6 8 10 100 10k 1k 07712-006 frequency (hz) sensitivity (db) figure 6 . frequency response mask 10 0 ?10 ?20 100 1k 10k frequency (hz) (db) 07712-007 figure 7 . typical frequency response (measured) 0 ?80 100 10k frequency (hz) psrr (db) 1k ?10 ?20 ?30 ?40 ?50 ?60 ?70 07712-008 figure 8 . typical power supply rejection ratio vs. f requency
admp401 rev. b | page 8 of 12 applications informa tion the admp401 output can be connected to a dedicated codec microphone input ( see figure 9 ) or to a high input impedance gain stage ( see figure 10 ). a 0.1 f ceramic capacitor placed close to the admp40 1 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. a dc - blocking capacitor is required at the output of the microphone . connecting the admp4 01 to a codec 07712-009 linn linp micbias adau1761 or adau1361 2.2f minimum v dd gnd admp401 output cm 0.1f figure 9 . admp401 connected to the analog devices adau1761 or adau1361 codec connecting the admp4 01 to an op amp gain stage 1f minimum 10k? r 2 r 1 v ref op177 07712-010 v dd gain = (r 1 + r 2 )/r 1 gnd admp401 output 0.1f v o v ref figure 10 . admp401 connected to the op177 op amp
admp401 rev. b | page 9 of 12 handling instruction s pick - and - place equipment the mems microphone can be handled using standard pick - and -p lace and chip shooting equipment. care should be taken to avoid damage to the mems microphone structure as follows: ? use a standard pickup tool to handle the microphone. because the microphone hole is on the bottom of the package, the pickup tool can make c ontact with any part of the lid surface. ? use care during pick - and - place to ensure that no high shock events above 20 k g are experienced because such events may cause damage to the microphone. ? do not pick up the microphone with a vacuum tool that makes con tact with the bottom side of the microphone. ? do not pull air out or blow air into the microphone port. ? do not use excessive force to place the microphone on the pcb . reflow solder for best results, the soldering profile should be in accordance with the r ecommendations of the manufacturer of the solder paste that is used to attach the mems microphone to the pcb. it is recommended that the solder reflow profile not exceed the limit conditions specified in figure 2 and table 3 . board wash when washing the pcb, ensure that water does not make contact with the microphone port. blow - off procedures and ultrasonic cleaning must not be used.
admp401 rev. b | page 10 of 12 reliability specific ations the microphone sensitivity after stress must deviate by no more than 3 db from the initial value. table 5 . stress test description low temperature operating life ?40c, 500 hours, powered high temperature operating life +125c, 500 hours, powered thb + 65c/85% relative h umidity , 500 hours, powered temperature cycle ?40c/+125c, one cycle per hour, 1 00 cycles high temperature storage + 150c, 500 hours low temperature storage ?40c, 500 hours component cdm esd all pins, 0.5 kv component hbm esd all pins, 1.5 kv compo nent mm esd all pins, 0.2 kv
admp401 rev. b | page 11 of 12 outline dimensions 3.80 3.76 3.66 4.82 4.72 4.62 bottom view top view side view 0.90 dia. (pins 1, 5, 6) 1 3 2 4 5 6 2.62 bsc 3.30 ref 1.10 dia. 1.68 dia. 0.25 dia. (thru hole) 0.79 bsc 2.54 bsc 1.27 bsc 1.10 1.00 0.90 0.24 ref 0.73 ref 1.20 bsc 2.40 bsc 0.68 ref 0.61 ref 0.70 dia. (pins 2, 4) 06-16-2010-c 3.14 ref 4.10 ref reference corner pin 1 figure 11 . 6- terminal chip array small outline no lead cavity [lga_cav] 4.72 mm 3.76 mm body (ce -6- 1) dimensions shown in millimeters 12.30 12.00 11.70 062408-a notes: 1. 10 sprocket hole pitch cumul a tive t o lerance 0.20. 2. pocket position rel a tive t o sprocket hole measured as true position of pocke t , not pocket hole. 4.80 3.20 1.50 min dia 8.00 4.00 1 1.60 max 1.50 nom a a section a-a 2.05 2 2.00 1.95 0.20 max 1.30 ref 1.60 0.35 0.30 0.25 3.80 2.20 1.85 1.75 1.65 5.55 2 5.50 5.45 detail a 0.50 r 0.25 0.25 detail a figure 12 . l ga_cav tape and reel outline dimensions dimensions shown in millimeters ordering guide model 1 temperature range package description package option 2 ordering quantity admp401acez - rl ?40c to +70c 6- terminal lga_cav, 13 tape and reel ce -6-1 5 ,000 admp401 acez - rl7 ?40c to + 70c 6- terminal lga_cav , 7 tape and reel ce -6-1 1,000 eval - admp401 z evaluation board 1 z = rohs compliant part. 2 the ce -6- 1 package option is halide free.
admp401 rev. b | page 12 of 12 notes ? 2010 analog d evices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d07712 -0- 12/10(b)

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