document no. 70-0334-02 www.psemi.com page 1 of 9 ?2010-2011 peregrine semiconductor corp. all right s reserved. the pe42750 is an spdt ultracmos? switch designed for broadband applications such as catv, dtv, multi-tuner digital video recorder (dvr ), set -top box, pctv and video game consoles. the pe42750 meets fcc 15.115 specification of 80 db isolation a t 216 mhz in both powered and unpowered states. the pe42750 covers a broad frequency range from 5 mhz t o 2200 mhz with a single positive supply and cmos control. the pe42750 provides a smaller, cost effe ctive, more reliable and manufacturable alternative to mechanical relays in set-top box applications. the pe42750 is manufactured using peregrine?s ultracmos? process, a patented variation of silicon -on- insulator (soi) technology on a sapphire substrate, offering the performance of gaas with the economy a nd integration of conventional cmos. product specification 75 terminated 5 - 2200 mhz spdt catv ultracmos? switch featuring unpowered operation product description pe42750 features ? meets fcc 15.115 isolation specification ? all ports terminated when unpowered ? 2000 v hbm esd tolerance, all ports ? high isolation: 63 db at 1000 mhz ? low insertion loss, typical: ? 0.7 db at 5 mhz ? 1.0 db at 1000 mhz ? cmos single-pin control with logic select ? single +3 volt supply operation ? low current consumption: 8 a ? absorptive switch design figure 1. functional diagram 3x3x0.75 mm 12-lead qfn figure 2. package type peregrine specification 71-0013
product specification pe42750 page 2 of 9 ?2010-2011 peregrine semiconductor corp. all right s reserved. document no. 70-0334-02 ultracmos? rfic solutions table 1. electrical specifications @ +25 c, v dd = +3 v (z s = z l = 75 ) notes: 1. measured in a 50 system 2. 0/3v on control pin, 1 ns rise time 3. minimum per fcc 15.115 spec 4. 10 dbm per tone for 1:3 ratio of fundamental t o imd3 products table 2. electrical characterization (unpowered ope ration) parameter condition minimum typical maximum units operating frequency 5 2200 mhz insertion loss - rfx to rfc 5 to 220 mhz 0.7 0.8 db 221 to 550 mhz 0.8 0.9 551 to 810 mhz 0.9 1.0 871 to 2200 mhz 1.7 1.8 isolation - rfx to rfx 3 5 to 220 mhz 80 84 db 221 to 550 mhz 70 76 551 to 810 mhz 65 72 871 to 2200 mhz 50 57 isolation - rfx to rfc 5 to 220 mhz 74 80 221 to 550 mhz 67 72 551 to 810 mhz 65 70 871 to 2200 mhz 51 55 return loss - rfx to rfc 5 to 220 mhz 221 to 550 mhz 551 to 810 mhz 811 to 870 mhz 871 to 2200 mhz 23 20 18 17 10 db iip2 rfx 1 5-2200 mhz 100 dbm iip3 rfx 1,4 5-2200 mhz 47.5 dbm input 1 db compression rfx or rfc 1 1000 mhz 21.5 23.5 dbm switching time 2 50% ctrl to 10/90% rf 2 3 s video feedthough 2 2 mvpp db 811 to 870 mhz 0.9 1.0 811 to 870 mhz 65 71 811 to 870 mhz 65 70 parameter condition minimum typical maximum units operating frequency 5 2200 mhz isolation rf1 to rf2 5 to 220 mhz 83 90 db 221 to 550 mhz 77 83 551 to 810 mhz 73 79 871 to 2200 mhz 65 72 811 to 870 mhz 73 79
product specification pe42750 page 3 of 9 document no. 70-0334-02 www.psemi.com ?2010-2011 peregrine semiconductor corp. all right s reserved. gnd rfc gnd c2 c1 v dd 5 6 4 11 10 12 no. name description 1 gnd rf ground 2 rf1 1 rf i/o 3 gnd rf ground 4 gnd rf ground 5 rfc 1 rf common 6 gnd rf ground 7 gnd rf ground 8 rf2 1 rf i/o 9 gnd rf ground 10 c2 2 control 2 (or logic select) 11 c1 2 control 1 (or logic select) 12 v dd supply pad gnd exposed ground paddle table 3. pin descriptions table 5. absolute maximum ratings electrostatic discharge (esd) precautions when handling this ultracmos? device, observe the same precautions that you would use with other esd-sensi tive devices. although this device contains circuitry t o protect it from damage due to esd, precautions should be taken to avoid exceeding the rating specified. table 4. operating conditions @ 25 c notes: 1. rf pins 2, 5, and 8 must be at 0 vdc. t he rf pins do not require dc blocking capacitors for proper opera tion if the 0 v dc requirement is met 2. pins 10 and 11 can be set for single pin contro l 3. gnd must be connected to exposed ground paddle to ensure good isolation figure 3. pin configuration (top view) parameter/condition min max unit v i voltage on ctrl input -0.3 v dd + 0.3 v p rf rf power on rfc, rf1, rf2 terminated/through 75 23/26 dbm t st storage temperature -55 +150 c v esd esd voltage, hbm, mil_std 883, method 3015.7 2000 v v esd mm esd voltage all pins jedec jesd22-a115-a 150 v esd cdm esd voltage jedec jesd22-c101d 1000 parameter min typ max unit v dd power supply 2.7 3.0 3.3 v i dd power supply current (v dd = 3 v, v cntl = 3 v) 8 a control voltage high 0.7 x v dd v dd v control voltage low 0 0.3 x v dd v t op operating temperature -40 +85 c p rf rf power on rfc, rf1, rf2 terminated/ through 75 23/26 dbm part performance is not guaranteed under these cond itions. exposure to absolute maximum conditions for extende d periods of time may adversely affect reliability. exceeding absolute maximum ratings may cause perman ent damage. operation between operating range maximum and absolute maximum for extended periods may reduce re liability . moisture sensitivity level the moisture sensitivity level rating for the pe427 50 in the 12-lead 3x3x0.75 mm qfn package is msl1. switching frequency the pe42750 has a maximum 25 khz switching rate. latch-up avoidance unlike conventional cmos devices, ultracmos? devices are immune to latch-up. operation should be restricted to the limits in the operating ranges table. table 6. truth table 1 v dd c1 c2 rfc ? rf1 rfc ? rf2 off 2 low low off off on low low on off on low high off on on high low off on on high high on off note: 1. a versatile logic table has been establish ed to allow either c1 or c2 to act as a single pin control and in ei ther polarity. 2. v dd at ?off? represents an all terminated state.
product specification pe42750 page 4 of 9 ?2010-2011 peregrine semiconductor corp. all right s reserved. document no. 70-0334-02 ultracmos? rfic solutions figure 4. nominal insertion loss (rfx-rfc) figure 7. active port return loss vs temperature (rfx) -2.5 -2 -1.5 -1 -0.5 0 0 0.5 1 1.5 2 2.5 3 rf1 rf2 -30 -25 -20 -15 -10 -5 0 0 0.5 1 1.5 2 2.5 3 -40 deg c 25 deg c 85 deg c performance plots @ 25c and 3.0v unless otherwise specified. figure 5. insertion loss vs temperature (rfx-rfc) figure 6. insertion loss vs v dd (rfx-rfc) -2.5 -2 -1.5 -1 -0.5 0 0 0.5 1 1.5 2 2.5 3 25 deg c -40 deg c 85 deg c figure 9. rfc port return loss vs temperature -2.5 -2 -1.5 -1 -0.5 0 0 0.5 1 1.5 2 2.5 3 3.0 v 2.7 v 3.3 v figure 8. active port return loss vs v dd (rfx) -30 -25 -20 -15 -10 -5 0 0 0.5 1 1.5 2 2.5 3 2.7 v 3.0 v 3.3 v -30 -25 -20 -15 -10 -5 0 0 0.5 1 1.5 2 2 .5 3 -40 deg c 25 deg c 85 deg c frequency (ghz) loss (db) loss (db) frequency (ghz) frequency (ghz) frequency (ghz) frequency (ghz) frequency (ghz) loss (db) loss (db) loss (db) loss (db)
product specification pe42750 page 5 of 9 document no. 70-0334-02 www.psemi.com ?2010-2011 peregrine semiconductor corp. all right s reserved. figure 10. rfc port return loss vs v dd figure 12. rf1-rf2 isolation vs temperature figure 11. rf1-rf2 isolation vs v dd figure 13. unpowered rf1-rf2 isolation -30 -25 -20 -15 -10 -5 0 0 0.5 1 1.5 2 2.5 3 2.7 v 3.0 v 3.3 v -100 -9 0 -8 0 -7 0 -6 0 -5 0 -4 0 0 0.5 1 1.5 2 2.5 3 -40 deg c 25 deg c 85 deg c -100 -9 0 -8 0 -7 0 -6 0 -5 0 -4 0 0 0.5 1 1.5 2 2.5 3 2.7 v 3.0 v 3.3 v -100 -9 0 -8 0 -7 0 -6 0 -5 0 -4 0 0 0.5 1 1.5 2 2.5 3 vdd=0v figure 15. input iip3 rfc-rfx figure 14. rfx-rfc isolation -110 -100 -90 -80 -70 -60 -50 -40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 measured performance on evk pcb extrapolated performance* 0 10 20 30 40 50 60 70 0 0.5 1 1 .5 2 2.5 3 rfx note: evk-pcb-related resonance removed from datas et. extrapolated performance shown represents true performance of pa rt. isolation (db) iip3 (dbm) frequency (ghz) frequency (ghz) frequency (ghz) loss (db) frequency (ghz) loss (db) frequency (ghz) loss (db) frequency (ghz) loss (db)
product specification pe42750 page 6 of 9 ?2010-2011 peregrine semiconductor corp. all right s reserved. document no. 70-0334-02 ultracmos? rfic solutions figure 16. typical application (1 of 3) figure 17. typical application (2 of 3) figure 18. typical application (3 of 3) dtv-tuner pe42750 spdt antenna input catv input 80db 54 ? 216mhz 60db 216 ? 550mhz 55db 550 ? 806mhz dtv-tuner pe42750 spdt dtv tuner antenna input catv input 80db 54 ? 216mhz 60db 216 ? 550mhz 55db 550 ? 806mhz power splitter power splitter pe42750 spdt dual tuner dtv / dvr / set-top box tuner catv input off ? terminated tv set / cable set-top box 75 ? pe42750 spdt rf2 typical applications the pe42750 provides the high isolation required by fcc part 15.115 regulation between the television antenna and the cable plant. the advantage of the pe42750 is that device isolation performance is maintained when power is removed. when the pe42750 is unpowered all ports are terminated.
product specification pe42750 page 7 of 9 document no. 70-0334-02 www.psemi.com ?2010-2011 peregrine semiconductor corp. all right s reserved. evaluation kit information figure 20. evaluation board layouts peregrine specification 101/0491 75 ohm t-line 75 ohm t-line 75 ohm t-line 75 ohm t-line notes: 4.3 er and 2.1mil cu thickness. 3. all transmision lines are: 12mil width, 12mil gaps, 28mil core dielectric to damage by electrostatic discharge (esd) 2. caution: 1. use 101-0491-01 contains parts and assemblies susceptible 1 2 j5 cbje130-2 r1 1m r2 1m 1 c1 3 c2 5 gnd 7 gnd 2 gnd 4 gnd 6 gnd 8 gnd 10 gnd 12 gnd 14 gnd 13 gnd 9 vdd 11 gnd j6 header 14 1 2 j4 cbje130-2 1 2 j3 cbje130-2 c3 dni c2 dni c1 dni 1 2 j2 cbje130-2 1 2 j1 cbje130-2 4 gnd 1 gnd 2 rf1 3 gnd 5 rfc 6 gnd 7 gnd 8 rf2 9 gnd 10 c2 11 c1 12 vdd u1 qfn_12l_3x3 rf1 rfc rf2 the spdt switch evaluation kit facilitates customer evaluation of the pe42750 spdt switch. the rf common port is connected through a 75 transmission line to j2. ports 1 and 2 are connected through 75 transmission lines to j1 and j3. a through line connects f connectors j4 and j5. this transmission line can be used to estimate the pcb loss over the environmental conditions. j6 provides dc and digital inputs to t he device. the board is composed of a two metal layer fr4 material with a total thickness of 0.032?. the transmission lines are hybrid microstrip/coplanar waveguide with ground plane (28 mil core, 12 mil width, 12 mil gap). the provided jumpers short the control pins to ground for logic low. with the jumper removed the control input rises to v dd for logic high through the 1 m pull up resistor. these resistors will draw several microamps from v dd. they are not required for normal operation. figure 19. evaluation board schematic peregrine specification 102/0586
product specification pe42750 page 8 of 9 ?2010-2011 peregrine semiconductor corp. all right s reserved. document no. 70-0334-02 ultracmos? rfic solutions figure 21. package drawing 3x3x0.75 mm 12-lead figure 22. marking specifications 42750 yyww zzzzz = pin 1 designator aaaaa = five digit part number yyww = date code, last two digits of the year and w ork week zzzzz = five digits of the lot number
product specification pe42750 page 9 of 9 document no. 70-0334-02 www.psemi.com ?2010-2011 peregrine semiconductor corp. all right s reserved. table 7. ordering information order code description package shipping method pe42750mlaa-z pe42750g-12lqfn 3x3mm-3000c green 12- lead 3x3mm qfn 3,000 dice/reel pe42750mlaa pe42750g-12lqfn 3x3mm-cut off tape and reel green 12-lead 3x3mm qfn bulk or tape cut from reel EK42750-01 pe42750-ek evaluation kit 1/box 12-lead 3x3x0.75 mm qfn figure 23. tape and reel specifications tape feed direction device orientation in tape top of device pin 1 ao = 3.30 0.1 mm bo = 3.30 0.1 mm ko = 1.10 0.1 mm advance information : the product is in a formative or design stage. the datasheet contains design target specifications for product developmen t. specifications and features may change in any manner without notice. preliminary specification: the datasheet contains preliminary data. additional data may be added at a later date. peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. product specification: the datasheet contains final data. in the event per egrine decides to change the specifications, peregrine will notify customers of the intended changes by issuing a cnf (customer notification form). the information in this datasheet is believed to be reliable. however, peregrine assumes no liability for the use of this information. use shal l be entirely at the user?s own risk. no patent rights or licenses to any circuits descri bed in this datasheet are implied or granted to any third party. peregrine?s products are not designed or intended f or use in devices or systems intended for surgical implant, or in other applications intended to suppo rt or sustain life, or in any application in which the failure of the peregrine product could create a sit uation in which personal injury or death might occu r. peregrine assumes no liability for damages, includi ng consequential or incidental damages, arising out of the use of its products in such applications. the peregrine name, logo, and utsi are registered t rademarks and ultracmos, harp, multiswitch and dune are trademarks of peregrine semiconductor corp. sales contact and information for sales and contact information please visit www. psemi.com.
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