? semiconductor components industries, llc, 2006 march, 2006 ? rev. 3 1 publication order number: nup4302mr6/d nup4302mr6 schottky diode array for four data line esd protection the nup4302mr6 is designed to protect high speed data line interface from esd, eft and lighting. features ? very low forward voltage drop ? fast switching ? pn junction guard ring for transient and esd protection ? esd rating of class 3b (exceeding 16 kv) per human body model and class c (exceeding 400 v) per machine model ? iec 61000 ? 4 ? 2 level 4 esd protection ? flammability rating: ul 94 v ? 0 ? pb ? free package is available applications ? ultra high ? speed switching ? usb 1.1 and 2.0 power and data line protection ? digital video interface (dvi) ? monitors and flat panel displays device package shipping ? ordering information nup4302mr6t1 tsop ? 6 3000/tape & reel marking diagram tsop ? 6 case 318g style 12 67 m 6 i/o 5 v cc 4 i/o i/o 1 gnd 2 1/o 3 pin configuration and schematic 1 1 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. 67 = specific device code m = date code = pb ? free package *date code orientation may vary depending upon manufacturing location. http://onsemi.com (note: microdot may be in either location) NUP4302MR6T1G tsop ? 6 (pb ? free) 3000/tape & reel
nup4302mr6 http://onsemi.com 2 maximum ratings (t j = 25 c unless otherwise noted) rating symbol value unit peak reverse breakdown voltage v br 30 v forward power dissipation (t a = 25 c) p f 225 mw forward continuous current i f 200 ma junction operating temperature t j ? 55 to +125 c storage temperature range t stg ? 55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. electrical characteristics (t j = 25 c unless otherwise noted) parameter symbol conditions min typ max unit reverse breakdown voltage v br i r = 100 a 30 v reverse leakage i r v r = 25 v 30 a forward voltage v f i f = 0.1 madc 0.28 v forward voltage v f i f = 1.0 madc 0.35 v forward voltage v f i f = 10 madc 0.45 v forward voltage v f i f = 100 madc 1.00 v total capacitance c t v r = 0 v, f = 1.0 mhz, i/o to ground v r = 0 v, f = 1.0 mhz, i/o to i/o 28 18 pf reverse recovery time t rr i f = i r = 10 ma, i r(rec) = 1.0 ma (figure 1) 5.0 ns notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2 k 820 0.1 f dut v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1 ma output pulse (i f = i r = 10 ma; measured at i r(rec) = 1 ma) i f input signal figure 1. recovery time equivalent test circuit
nup4302mr6 http://onsemi.com 3 1000 0 v f , forward voltage (volts) 0.2 0.4 0.6 0.8 100 10 1 100 0 v r , reverse voltage (volts) 0.1 5101520 25 0 v r , reverse voltage (volts) 10 5 0 510 15 30 figure 2. forward current as a function of forward voltage; typical values figure 3. reverse current as a function of reverse voltage; typical values figure 4. diode capacitance as a function of reverse voltage; typical values 1 . 0 1000 10,000 30 25 20 15 25 i f , forward current (ma) 85 c t a = 1 25 c 25 c 1 10 i r , reverse current ( a) 85 c t a = 1 25 c 25 c c d , diode capacitance (pf) 20 30 35 40 f = 1 mhz t a = 25 c
nup4302mr6 http://onsemi.com 4 package dimensions tsop ? 6 case 318g ? 02 issue p 23 4 5 6 d 1 e b e a1 a 0.05 (0.002) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. c l 0.95 0.037 1.9 0.075 0.95 0.037 mm inches scale 10:1 1.0 0.039 2.4 0.094 0.7 0.028 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 12: pin 1. i/o 2. ground 3. i/o 4. i/o 5. vcc 6. i/o h e dim a min nom max min millimeters 0.90 1.00 1.10 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.25 0.38 0.50 0.010 c 0.10 0.18 0.26 0.004 d 2.90 3.00 3.10 0.114 e 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 l 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.014 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 nom max 2.50 2.75 3.00 0.099 0.108 0.118 h e ? ? 0 1 0 0 1 0 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 nup4302mr6/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
|
