gdsga0-500e gdsga0-700e GDSGA0-900E gdsga0-b00e standard gpp chip - 100mil chips for std gpp/soldering type type: gdsga0 series chip appearance features * silicon chip with boron / phosphorus dopants maximum instantaneous forward voltage at 3a dc maximum average reverse current at rated dc blocing voltage storage temperature range operating temperature range maximum recurrent peak reverse voltage maximum average forward rectified current at derating case temperature * solderable metallization ni / au * glass passivated junction chip dimensions gdsga0-b00e gdsga0-500e chip size contact area total chip thickness solderable metallization 100 x 100 mils 75 x 75 mils 11 mils ni / au gdsga0-700e GDSGA0-900E gdsga0-b00e gdsga0-500e gdsga0-700e GDSGA0-900E product specifications r a t i n g s s y m b o l t s t g u n i t s 0 c t j 0 c i o v r 400 @ t a =25 o c @ t a =100 o c 1.1 3 5 300 150 -55 to + 150 600 800 1000 amps uamps volts volts i r v f rectron technica l specific a tion semiconduc t or 11 m i l 10.2 m i l 100 m i l 75 m i l
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