cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 1/7 BTC2880A3 cystek product specification general purpose npn epitaxial planar transistor BTC2880A3 description the BTC2880A3 is designed for general purpose medium power amplifier and switching applications. features ? low collector saturation voltage ? high breakdown voltage, v ceo =100v (min.) ? high collector current, i c(max) =1a (dc) ? pb-free package symbol outline BTC2880A3 to-92 e c b b base c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 180 v collector-emitter voltage v ceo 100 v emitter-base voltage v ebo 7 v collector current (dc) i c 1 a collector current (pulse) i cp 2 (note) a power dissipation p d 850 mw thermal resistance, junction to ambient r ja 147 c/w junction temperature tj 150 c storage temperature tstg -55~+150 c note : pulse test, p w 10ms, duty 50%.
cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 2/7 BTC2880A3 cystek product specification characteristics (ta=25c) symbol min. typ. max. unit test conditions bv cbo 180 - - v i c =50 a bv ceo 100 - - v i c =1ma bv ebo 7 - - v i e =50 a i cbo - - 100 na v cb =150v, i e =0 i ebo - - 100 na v eb =6v, i c =0 *v ce(sat) - 0.09 0.2 v i c =350ma, i b =35ma *v ce(sat) - 0.11 0.25 v i c =500ma, i b =50ma *v ce(sat) - 0.22 0.5 v i c =1a, i b =50ma *v be(sat) - - 1 v i c =500ma, i b =50ma *v be(on) - - 1 v v ce =5v, i c =500ma *h fe 1 80 - - - v ce =1v, i c =50ma *h fe 2 82 - 270 - v ce =1v, i c =250ma *h fe 3 60 - - - v ce =1v, i c =500ma f t 50 - - mhz v ce =10v, i c =50ma, f=100mhz cob - - 20 pf v cb =10v, i e =0a, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% classification of h fe 2 rank p q range 82~180 120~270 ordering information device package shipping marking BTC2880A3 to-92 (pb-free) 2000 pcs / tape & box c2880
cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 3/7 BTC2880A3 cystek product specification characteristic curves current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current ---ic(ma) current gain---hfe hfe vce=5v vce=2v vce=1v saturation voltage vs collector current 10 100 1000 1 10 100 1000 10000 collector current ---ic(ma) saturation voltage-(mv) vcesat ic=10ib ic=20ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current--- ic(ma) saturation voltage-(mv) vbesat@ic=10ib on voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current--- ic(ma) on voltage-(mv) vbeon@vce=5v power derating curve 0 100 200 300 400 500 600 700 800 900 0 25 50 75 100 125 150 175 200 ambient temperature---ta() power dissipation---pd(mw)
cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 4/7 BTC2880A3 cystek product specification recommended ir reflow profile average ramp-up rate(25 to 150 ) 1~4 /second preheat temperature 150~180 60~90 seconds temperature maintained above 220 30 seconds min. 3~5 seconds time within 5 of actual peak temperature peak temperature range 255+0/-5 ramp-down rate 2~10 /second 6 minutes max. time 25 to peak temperature
cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 5/7 BTC2880A3 cystek product specification recommended temperature profile for wave soldering recommendation: 1. preheat temperature at solder side must be between 100 and 130 for 80 to 100 seconds. 2. temperature ramp-up rate : 1~2 /s 3. the temperature gradient between preheat and wave solder ing must be smaller than +100 . 4. terminations must go through the wave simultaneously. 5. travel through the wave from 255 to 260 for 2.5 to 3.5 seconds 6. temperature ramp-down rate : 2~3 /s
cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 6/7 BTC2880A3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 lead diameter h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c319a3 issued date : 2007.05.04 revised date : page no. : 7/7 BTC2880A3 cystek product specification to-92 dimension *: typical inches c2880 hfe rank 3 1 a d b c i 1 e f 2 3 g h 2 s t yle: pin 1.emitter 2.collector 3.base 3-lead t o -92 plastic package cy s t ek p a cka g e code: a 3 9 9, a 10, b 11 , c 12 product nam e date code: y ear+month y ear: 4 2004, 5 2005 month: 1 1, 2 2, ??? , marking: m i l l i m e t e r s i n c h e s m i l l i m e t e r s dim m i n . m a x . m i n . m a x . dim m i n . m a x . m i n . m a x . a 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 g 0.0142 0 . 0 2 2 0 0 . 3 6 0 . 5 6 b 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 h - * 0 . 1 0 0 0 - * 2.54 c 0 . 5 0 0 0 - 1 2 . 7 0 - i - * 0 . 0 5 0 0 - * 1.27 d 0 . 0 1 4 2 0 . 0 2 2 0 0 . 3 6 0 . 5 6 1 - * 5 - * 5 e - * 0 . 0 5 0 0 - * 1.27 2 - * 2 - * 2 f 0 . 1 3 2 3 3 . 7 6 3 - * 2 - 0 . 1 4 8 0 3 . 3 6 * 2 notes: 1.contr o lling dimension: millimeter s. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question w i th p a cking spec ification or p a cking method, please cont act y our local cy s t ek sales of fice. material: ? lead: 42 alloy ; solder plating ? mold compound: epox y resin family , flammability solid burning class: ul94v -0 important notice: ? all rights are reserved. reproduction in w hole or in part is prohibited w i thout the prior w r itten approval of cy stek. ? cy stek reserves the right to make changes to its products w i thout notice. ? cy stek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cy stek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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