page 1 of 9 sgp.12 a specifcation part no. sgp.1575.12.4.a.02 product name gps smt patch antenna features 12mm*12mm*4.5mm 1575mhz centre frequency patent pending rohs compliant spe-11-8-136/d/ss |
page 2 of 9 this ceramic gps patch antenna is based on smart xtremegain tm technology. it is mounted via smt process and has been selected as optimal solution for the 45x45mm ground plane. 1. introduction 2. specifcation original patch specifcation tested on 45mm ground plane **changes in user groundplane and environment will offset centre frequency parameter specifcation notes range of receiving frequency 1575.42 1.023mhz center frequency 1575.42 3mhz with 45*45mm ground plane bandwidth 4mhz min return loss -10 db return loss -10 db vswr 1.5 max gain at zenith - 1.0 dbic typ. gain at 10 elevation - 1.5 dbic typ. axial ratio 4.0 db max polarization rhcp impedance 50 ohms frequency temperature coeffcient ( t f) 0 20ppm / c -40oc to +85oc operating temperature -40c to +85c spe-11-8-136/d/ss |
page 3 of 9 3. electrical specifcations 3.1 return loss, swr, impedance, measured on the test fxture marker 1 1. 575 42 ghz -14. 479 db 1 1 mkr 1: 1.575 42ghz -14.479 db mkr 1: 1.575 42ghz 41.014 ? 14.917 ? c . f = 1 576 309 756. 8 h z l . f = 1 573 254 844. 1 h z r . f = 1 579 364 669. 6 h z bw = 6 09 825. 5 h z o = 55 . 874 sf = spe-11-8-136/d/ss |
page 4 of 9 4. mechanical specifcations 4.1 dimensions and drawing this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b name part no. material finish quantity sgp.12 pcb spe-11-8-136/d/ss |
page 5 of 9 4.2 antenna footprint this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b note: this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b spe-11-8-136/d/ss |
page 6 of 9 4.3 test jig and dimension spe - 11- 8 - 136/b /ss page 6 of 8 4 .3 test jig and dimension spe-11-8-136/d/ss |
page 7 of 9 4.4 test fixture set up and measurements spec no. sp03ab15752-0040 issued date 2012.01.04 published by version 03 product name sma 1575e page 8/9 ? ??????? ??????? ??????? ??????? ?? ?}u?? 17 test jig and dimension 18 test fixture antenna setup & measurements calibration point network analyzer s11 characteristics log map smith chart sma adapter ground plane test fixture antenna setup & measurements spec no. sp03ab15752-0040 issued date 2012.01.04 published by version 03 product name sma 1575e page 8/9 ? ??????? ??????? ??????? ??????? ?? ?}u?? 17 test jig and dimension 18 test fixture antenna setup & measurements calibration point network analyzer s11 characteristics log map smith chart sma adapter ground plane 45 by 45mm ground plane calibration point patch antenna network analyzer s11 characteristics log map smith chart sma adapter spe-11-8-136/d/ss |
page 8 of 9 5. antenna recommended soldering conditions 5.1 flux, solder 5.2 refow soldering conditions ? use rosin-based fux. dont use highly acidic fux with halide content exceeding 0.2wt%(chlorine conversion value). ? use sn solder. ? pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max. cooling into solvent after soldering also should be in such a way that temperatur e difference is limited to 100 max. unwrought pre-heating may cause cracks on the product, resulting in the deterioration of products quality. temp(c) 240 c 230 c 180 c 0 c 60-120sec 10-30sec time (s) 5 sec (peak 245 c) 5.3 refow with soldering iron ? the following conditions must be strictly followed when using a soldering ir on. pre-heating 150 , 1 min tip temperature 290 max soldering iron output 30w max soldering time 3 second max spe-11-8-136/d/ss |
page 9 of 9 6. packaging spec no. sp03ab15752-0040 issued date 2012.01.04 published by version 03 product name sma 1575e page 9/9 ? ??????? ??????? ??????? ??????? ?? ?}u?? 19 delivery mode 500 pcs / reel / inner carton 5 reels in an outer carton (2500) taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifcations and product descriptions at any time without notice. taoglas reserves all rights to this document and the information contained herein. reproduction, use or disclosure to third parties without express permission is strictly prohibited. copyright ? taoglas ltd. spe-11-8-136/d/ss |
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