nichia sts-da1-2751c nichia corporation specifications for uv led nshu591b built-in esd protection device rohs compliant
nichia sts-da1-2751c 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 25 ma pulse forward current i fp 80 ma allowable reverse current i r 85 ma power dissipation p d 100 mw operating temperature t opr -30~85 c storage temperature t stg -40~100 c junction temperature t j 100 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =20ma 3.4 v radiant flux e i f =20ma 4.0 mw peak wavelength p i f =20ma 365 nm spectrum half width ? i f =20ma 12 nm * characteristics at t a =25c. * radiant flux value as per cie 127:2007 standard.
nichia sts-da1-2751c 2 ranks item rank min max unit forward voltage - 2.9 4.0 v 7 5.34 7.56 6 3.78 5.34 radiant flux 5 2.67 3.78 mw peak wavelength ua 360 370 nm * ranking at t a =25c. * forward voltage tolerance: 0.05v * radiant flux tolerance: 10% * peak wavelength tolerance: 3nm * leds from the above ranks will be shipped. the rank combination ratio per sh ipment will be decided by nichia.
nichia sts-da1-2751c 3 outline dimensions sts-da7-2626 nshu591x ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device description ?| hard glass ?? + ??? ni-plated iron alloy ? item | glass materials ??| cap materials `?| lead materials ?? + ? au-plated iron alloy | weight 0.32g(typ) 5.4 4.7 1 1 14.51 0.4 4.50.4 0.5 (2.5) 6.20.4 anode cathode glass
nichia sts-da1-2751c 4 soldering ? recommended hand soldering condition temperature 350c max soldering time 3sec max position no closer than 3mm from the base of the lead. ? recommended dip soldering condition pre-heat 120c max pre-heat time 60sec max solder bath temperature 260c max dipping time 10sec max dipping position no closer than 3mm from the base of the lead. * solder the led no closer than 3mm from the base of the lead. * dip soldering/hand soldering must not be performed more than once. * care should be taken to avoid cooling at a rapid ra te and ensure the peak temperature ramps down slowly. * when soldering, do not apply stress to the lead frame while the led is hot. * when using a pick and place machine, ch oose an appropriate nozzle for this product. * after soldering, the led position must not be corrected. * after soldering, no mechanical shock or vibration should be applied to led cap until the leds cool do wn to room temperature. * in order to avoid damage on the cap during cutting and clinching the leads, it is not recommended to solder th e leds directly on customer pcb withou t any gap between the cap and the board. if it is unavoidable, customer is advised to check whether such soldering wi ll not cause wire breakage or cap damage. direct soldering to double-sided pcbs must be avoided due to an in creased effect of heat on the cap. * when it is necessary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. * cut the led lead frames at room temper ature. cutting the lead frames at high temperature may cause failure of the leds. * consider factors such as the dip sold ering temperature, hand soldering temper ature, etc. when choosing the solder. * when flux is used, it should be a ha logen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds.
nichia sts-da1-2751c 5 packaging - bulk ? label attached to the box ? label printed on the bag nichia led sts-da7-1137b nxxxxxxx ? no. anti-electrostatic bag ?? nxxxxxxx rohs ******* uv led type lot ymxxxx-rrr qty pcs nichia corporation 491 oka, kaminaka, anan, tokushima, japan led uv led led radiation caution to electrostatic damage ??? rohs nxxxxxxx uv led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan ? warning and explanatory labels led radiation avoid exposure to beam clas s 3b led produc t le d ?`???? ? 3b l e d u? uv led led radiation led ?y?? ?Q????? 1m led u? class 1m led product do not view directly with optical instruments anti-electrostatic bags are packed in cardboard boxes with corrugated partitions. ??K???`? ? for details, see "lot numbering code" in this document. * ??????????? if not provided, it will not be indicated on the label. ******* is the customer part number. O??????? * ******* ?? products are packed in an anti-electrostatic bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. using the original package material or equivalent in transit is recommended. ?`???????y?????? * ??\H?y?B???y? * ?QH??n?????u?p?????? * * u???????n?go??`y? do not expose to water. the box is not water-resistant. do not drop or expose the box to extern al forces as it may damage the products.
nichia sts-da1-2751c 6 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by wavelength, ranking by radiant flux
nichia sts-da1-2751c 7 derating characteristics sts-da7-2699 ? no. nshu591x derating1 0 10 20 30 40 50 0 2040 6080100120 (25 , 25.0) (85, 5 .00 ) dut y 1 10 100 110100 25 80 S all owa bl e f orwar d c urr ent ( m a) ??-S ambient temperature vs allowable forward current S allowable forward curr ent(ma) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a = 25c
nichia sts-da1-2751c 8 optical characteristics nshu591b ? no. sts-da7-2703a spectrum 0.0 0.2 0.4 0.6 0.8 1.0 300 350 400 450 500 550 600 ? relative radiant intensity(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -1 0 -20 -3 0 -40 -5 0 -6 0 -7 0 -80 -9 0 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.5 1 20ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 20 ma i fp = t a =25c
nichia sts-da1-2751c 9 forward current characteristics / temperature characteristics nshu591b sts-da7-4242 ? no. tavf 2.5 3.0 3.5 4.0 4.5 5.0 -60 -40 -2 0 0 20 40 60 80 10 0 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -2 0 0 20 40 60 80 1 00 120 vfif 1 10 10 0 2.5 3.0 3.5 4.0 4.5 5.0 20 80 relative radiant flux(a.u.) ??- ambient temperature vs relative radiant flux for ward curren t( m a) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 406080100 relative radiant flux(a.u.) - forward current vs relative radiant flu x forw ard current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) i fp = 20ma i fp = 60ma i fp = 5ma t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 20ma
nichia sts-da1-2751c 10 forward current characteristics / temperature characteristics ? no. nshu591b sts-da7-2705 if d 359 361 363 365 367 369 371 110100 ta d 359 361 363 365 367 369 371 -60 -40 -20 0 2 0 40 6 0 80 100 120 20ma i fp = -?`L forward current vs peak wavelength for ward current(ma) ??-?`L ambie nt te mperature vs peak wavelength peak wavelength(nm) ?` L peak wavelength(nm) ?` L ?? ambient temperature(c) * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c
nichia sts-da1-2751c 11 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat jeita ed-4701 300 302 t sld =2605c, 10sec, 1dip, 3mm from the base of the lead #1 0/50 solderability jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/50 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/50 te r m i n a l b e n d strength jeita ed-4701 400 401 5n, 0~90~0bend, 2bending cycles #1 0/50 terminal pull strength jeita ed-4701 400 401 10n, 101sec #1 0/50 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/50 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/50 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/50 room temperature operating life t a =25 , i f =25ma 500hours #1 0/50 temperature humidity operating life 60c, rh=90%, i f =15ma 500hours #1 0/50 low temperature operating life t a =-30c, i f =20ma 1000hours #1 0/50 notes: measurements are performed after allowi ng the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =20ma >u.s.l.1.1 #1 radiant flux( e ) i f =20ma nichia sts-da1-2751c 12 cautions (1) lead forming when forming leads, the leads sh ould be bent at a point at leas e 3mm from the base of the lead. do not use the base of the leadfra me as a fulcrum during lead forming. lead forming should be done before soldering. do not apply any bending stress to the base of the lead. the stress to the base may damage the led's characteristics or it may break the leds. when mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned with the lead pitch of the product. if the leds are mounte d with stress at the leads, it causes deterioration of the cap and this will degrade the leds. (2) storage shelf life of the products in unopened bag is 3 mont hs(max.) at <30c and 70% rh from the delivery date. if the shelf life exceeds 3 months or more, th e leds need to be stored in a sealed container with silica gel desiccants to ensure their shelf life will not exceed 1 year. nichia led leadframe are gold plated iron alloy. this gold surface may be affected by environments which contain corrosive substances. please avoid conditio ns which may cause the led to corrode, tarnish or discolor. this corrosion or discoloration may ca use difficulty during soldering operation. it is recommended that the le ds be used as soon as possible. to avoid condensation, the pr oducts must not be stored in the areas where temperature and humidity fluctuate greatly. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (3) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated using forward curre nt. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater th an 10% of the sorting current to stabilize the led characteristic s. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. this led also emits visible light. please take notice of visible light spectrum, in case you use this led as light source of sensors etc. (4) handling precautions do not handle the leds with bare hands as it will contaminat e the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the wi re to break, which will cause the led not to illuminate. the lead could also cause an injury. dropping the produc t may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the cap portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures.
nichia sts-da1-2751c 13 (5) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. (6) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and mach ines that are being used are properly grounded and that proper grounding techniques are used in wo rk areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forw ard voltage measurement at low current ( 1ma). esd damaged leds may have current flow at a low voltage. failure criteria: v f <2.0v at i f =0.5ma (7) thermal management proper thermal management is an impo rtant when designing produc ts with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (8) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds , soak a cloth with isopropyl alcohol (ipa), then squeeze it before wiping the leds. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advise d to make sure the leds will not be damaged prior to cleaning.
nichia sts-da1-2751c 14 (9) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825- 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. the products are uv light leds, and radiate intense uv light during operation. since uv light can be harmful to eyes, do not look directly into the uv light, even through an optical instrument. in case of the light reflection, uv protective glasses ar e required to use in order to avoid damage by the light. (10) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of th is product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
|
