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para light electronics co., ltd. 4f, no.1, lane 93, chien yi road, chung ho city, taipei, taiwan tel: 886-2-2225-3733 fax: 886-2-2225-4800 e-mail: para@para.com.tw http://www.para.com.tw data sheet part no. : L-C170KGCT rev : b / 3 customer?s approval : _______________ dcc : ____________ drawing no. : ds-72-03-0005 date : 2009-11-26 page 1 of 14 para-for-065
surface mount device led part no. : L-C170KGCT rev:b / 3 z package outline dimensions p.c board polarity 1.25 top view r0.10 led dice molding body (lens) side view 0.45 back view 1.05 - 0.35 ref. 0.95 0.80 0.28 ~ 0.30 5.00?? cathode 0.45 soldering terminal 2.00 1.50 + notes: 1. all dimensions are in millimeters. 2. tolerance is ? 0.1mm (.004") unless otherwise noted. z features ? top view, wide view angle, single color chip led. ? package in 8mm tape on 7" diameter reels. ? compatible with automatic pick & place equipment. ? compatible with infrared and wave soldering reflow solder processes. ? eia std package. ? i.c. compatible. ? pb free product. ? meet rohs green product. drawing no. : ds-72-03-0005 date : 2009-11-26 page 2 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z chip materials ? dice material : alingap ? light color : super green ? lens color : water clear z absolute maximum ratings(ta=25 ?? ) symbol parameter rating unit p d power dissipation 60 mw i pf peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma i f continuous forward current 30 ma - de-rating linear from 25 j 0.25 ma/ j v r reverse voltage 5 v esd electrostatic discharge threshold(hbm) note a 2000 v topr operating temperature range -40 ~ +85 j tstg storage temperature range -40 ~ +85 j note a : hbm : human body model. seller gives no othe r assurances regarding the ability of to withstand esd. z electro-optical characteristics(ta=25 ?? ) parameter symbol min. typ. max. unit test condition luminous intensity iv 16.0 30.0 mcd if=20ma viewing angle 2 | 1/2 130 deg note 2 peak emission wavelength |? p 571 nm measurement @peak dominant wavelength |? d 570 nm if=20ma spectral line half-width ||? 15 nm forward voltage vf 2.05 2.4 v if =20ma reverse current ir 10 | a vr = 5v drawing no. : ds-72-03-0005 date : 2009-11-26 page 3 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z bin code list luminous intensit y( iv ) , unit:mcd @ 20ma forward volta g e ( vf ) , unit:v @ 20ma bin code min max bin code min max m 18.0 28.0 4 1.90 2.00 n 28.0 45.0 5 2.00 2.10 p 45.0 71.0 6 2.10 2.20 7 2.20 2.30 tolerance of each bin are ? 15% tolerance of each bin are ? 0.1volt dominant wavelength (hue),unit: nm@20ma bin code min max ga 567.0 570.0 gb 570.0 573.0 gc 573.0 576.0 tolerance of each bin are ? 1nm notes: 1. luminous intensity is measured with a lig ht sensor and filter combination that proximities the cie eye-response curve. 2. | 1/2 is the off-axis angle at which the lu minous intensity is half the axial luminous intensity. 3. the dominant wavelength |? d is derived from the cie chromaticity diagram and represents the single wavelength whic h defines the color of the device. 4. caution in esd : static electricity and surge damages the led. it is recommended use a wrist band or anti-electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. 5. major standard testing equipment by ?ins trument system? model : cas140b compact array spectrometer and ?keith ley? source meter model : 2400. drawing no. : ds-72-03-0005 date : 2009-11-26 page 4 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z typical electro-optical characteristics curves (25 j ambient temperature unless otherwise noted) relative luminous intensity(%) 1 fig.6 forward current derating curve 40 ambient temperature ta( ?? ) 0 0 20 60 80 100 fig. 4 relative luminous inte nsity vs.forward current forward current if(ma) 10 20 30 40 50 0.7 80 90 fig.7 relative intensity vs.angle 0.5 0.3 0.4 0.1 0.2 0.6 70 60 50 40 30 fig.5 luminous intensity vs.ambient temperature 0.8 0.9 1.0 ambient temperature ta( ?? ) - 4 0 -60 -20 -0 0 10 20 60 20 4 0 80 100 fig.3 luminous intensity vs.forward current luminous lntensity(mcd) fig.2 forward current vs.forward voltage relative luminous lntensity normalized of 20ma 10 100 1000 drawing no. : ds-72-03-0005 date : 2009-11-26 page 5 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z label explanation cus. part no: to be denominated. customer: to be denominated. part no: refer to p14 iv --- luminous intensity code vf --- forward voltage code wd --- dominant wavelength code lot no: e l s 6 8 0001 a---e: for series number b---l: local f: foreign c---s:smd d---year e---month f---spec. packing quantity of bag : 3000pcs for 150 ? 170 ? 110 ? 155 ? 115 series 4000pcs for 191 series 5000pcs for 192 series date code o 2006 06 08 g h i g--- ye ar h--- month i --- day drawing no. : ds-72-03-0005 date : 2009-11-26 page 6 of 14 para-for-068 a b c d e f
surface mount device led part no. : L-C170KGCT rev:b / 3 z typical electro-optical characteristics curves fig.1 relative intensity vs. wavelength z reel dimensions notes: 1. taping quantity : 3000pcs 2. the tolerances unless mentioned is ? 0.1mm, angle ? 0.5 ?? , unit : mm. drawing no. : ds-72-03-0005 date : 2009-11-26 page 7 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z package dimensions of tape and reel polarity progressive direction notes:all dimensions are in millimeters. moisture resistant packaging label aluminum moistue-proof bag desiccant label h:\smd\smd\smd \ ? ? .jpg h:\smd\smd\smd \ ? ? .jpg h : \ s m d \ s m d \ s m d \ ? ? . j p g h : \ s m d \ s m d \ s m d \ ? ? . j p g 2 5 5 435 145 2 4 0 2 1 0 label box carton reel notes : one reel in a bag, one bag in a i nner box, ten inner boxes in a carton. unit : mm. drawing no. : ds-72-03-0005 date : 2009-11-26 page 8 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z cleaning ? if cleaning is required , use the following solutions for less than 1 minute and less than 40 ?? . ? appropriate chemicals: ethyl al cohol and isopro pyl alcohol. ? effect of ultrasonic cleaning on the led resi n body differs depending on such factors as the oscillator output, size of pcb and led mounting method. the use of ultrasonic cleaning should be enforced at proper out put after confirming there is no problem. z suggest soldering pad dimensions direction of pwb camber and go to reflow furnace drawing no. : ds-72-03-0005 date : 2009-11-26 page 9 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 ?? suggest sn/pb ir reflow soldering profile condition: ?? suggest pb-free ir reflow soldering profile condition: drawing no. : ds-72-03-0005 date : 2009-11-26 page 10 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z cautions 1.application limitation : the led?s described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application).consult para?s sales in advance for information on application in which exceptional quality and reliability are re quired, particularly when the failure or malfunction of the led?s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.storage : before opening the package : the leds should be store kept at 5c to 30c or less and 85%rh or less. after opening the package : the leds should be kept at 5c to 30c or less and 70%rh or less. the leds should be soldered within 168 hours(7 days) af ter opening the package. please avoid rapid transitions in ambient temp erature in high humidity environments where condensation may occur. leds stored out of their original packaging for more than a week should be baked at 30 ?? c for at 24 hours before solder assembly. 3.soldering do not apply any stress to the lead frame during soldering while the led is at high temperature. recommended soldering condition. reflow soldering : pre-heat 120~150c, 120sec. max., peak temperat ure : 240c max. soldering time : 10 sec max. soldering iron : (not recommended) temperature 300c max., soldering time : 3 sec. max.(one time only), power dissipation of iron : 20w max. use sn60 solder of solder with s ilver content and don?t to touch led lens when soldering. drawing no. : ds-72-03-0005 date : 2009-11-26 page 11 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 wave soldering : pre-heat 100c max, pre-heat time 60 sec. max, solder wave 260c max, soldering time 5 sec. max. preformed consecutively cooling process is required between 1 st and 2 nd soldering processes. 4. lead-free soldering for reflow soldering : 1 ?b pre-heat temp:150-180 j ,120sec.max. 2 ?b soldering temp:temperature of soldering pot over 230 j ,40sec.max. 3 ?b peak temperature:260 j?a 5sec. 4 ?b reflow repetition:2 times max. 5 ?b suggest solder paste formula 93.3 sn/3.1 ag/3.1 bi /0.5 cu for soldering iron (not recommended) : 1 ?b iron tip temp:350 j max. 2 ?b soldering iron:30w max. 3 ?b soldering time:3 sec. max. one time. for dip soldering : 1 ?b pre-heat temp:150 j max. 120 sec. max. 2 ?b bath temp:265 j max. 3 ?b dip time:5 sec. max. 5. drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness be tween led`s could be found due to the vf-if characte ristics of led. drawing no. : ds-72-03-0005 date : 2009-11-26 page 12 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 6.reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs)*@20ma. mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ir-reflow in-board, 2 times ta= 655 ?? ,rh= 90 ?? 95% *test time= 1000hrs2hrs mil-std-202f:103b(1980) jis c 7021:b-11(1982) high temperature storage ta= 1055 ?? test time= 1000hrs (-24hrs,72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 ?? * test time=1000hrs (-24hrs,72h rs) jis c 7021:b-12 (1982) temperature cycling 1055 ?? -555 ?? 10mins 10mins 100 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021:a-4(1982) thermal shock ir-reflow in-board, 2 times 1055 ?? -55 ?? 5 ?? 10mins 10mins 100 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance tsol= 260 5 ?? dwell time= 10 1sec mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021:a-1(1982) environmental test solder ability tsol= 235 5 j immersion time 20.5 sec immersion rate 252.5 mm/sec coverage ? 95% of the dipped surface mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) iec 68 part 2-20 jis c 7021:a-2(1982) 7.others: the appearance and specifications of the product may be modified for improvement without notice. drawing no. : ds-72-03-0005 date : 2009-11-26 page 13 of 14 para-for-068
surface mount device led part no. : L-C170KGCT rev:b / 3 z part no. system : l ? c 1 7 0 x c x x - x x x x drawing no. : ds-72-03-0005 date : 2009-11-26 page 14 of 14 para-for-068 xxxx : special specification for customer t : taping for 7 inch reel tc : taping for 13 inch reel th : iv half binning tp : wavelength binning lens color c : water clear w : white diffused t : color transparent d : color diffused g : gap 570nm green y : gaasp 585 nm yellow e : gaasp 620 nm orange sr : gaalas 634 nm red kg : alingap 570nm super green ky : alingap 590nm super yellow kf : alingap 605nm super amber kr : alingap 630 nm super red lb : ingan 470nm blue lg : ingan 525nm green 0 : single chip 1/2 : super thin single chip 5/6 : dual chip f : three chip(full color) 150 : 1206 1.1t type 170 : 0805 0.8t type 191 : 0603 0.6t type 192 : 0603 0.4t type 110 : 1206 1.0t type c : top view type s : side view type

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