________________________________________________________________________ http://www.union-ic.com rev.02 jul.2012 1/6 UM5204EECD quad channel low capacitance esd protection array UM5204EECD tsop-6/sot23-6 general description UM5204EECD is surge rated diode arrays designed to protect high speed data interfaces. this series has been specifically designed to protect sen sitive components which are connected to data and transmission lines from over-voltage caused by esd (electrostatic discharge). the unique design incorporates surge rated, low capacitance steering diodes and a tvs diode in a single package. during transient conditions, the steer ing diodes direct the transient to either the positive side of the power supply line or to ground. the internal tvs diode prevents over-voltage on the power line, protecting any downstream components. the low capacitance array configuration allows th e user to protect four high-speed data or transmission lines. the low inductance constr uction minimizes voltage overshoot during high current surges. this device is optimized for esd protection of portable electronics. they may be used to meet the esd immunity requirements of iec 61000-4-2, level 4 ( 15kv air, 8kv contact discharge). applications features z usb 2.0 z usb otg z monitors and flat panel z displays digital visual interface (dvi) z high-definition multimedia interface (hdmi) z sim ports ieee 1394 firewire ports z transient protection for high-speed data lines to iec 61000-4-2 (esd) 15kv (air), 8kv (contact) z array of surge rated diodes with internal tvs diode z protects up to four i/o lines & power line z low capacitance (<2pf) for high-speed interfaces z no insertion loss to 2.0ghz z low leakage current and clamping voltage z low operating voltage: 5.0v z solid-state silicon-avalanche technology pin configurations top view xx: week code UM5204EECD tsop-6/sot23-6
________________________________________________________________________ http://www.union-ic.com rev.02 jul.2012 2/6 UM5204EECD ordering information part number working voltage packaging type channel marking code shipping qty UM5204EECD 5.0v tsop-6/sot23-6 4 ucf 3000pcs /7inch tape & reel absolute maximum ratings peak pulse power (tp = 8/20s) p pk 150 watts peak pulse current (tp = 8/20s ) i pp 6 a esd per iec 61000-4-2 (air) esd per iec 61000-4-2 (contact) v esd 15 8 kv operating temperature t j -55 to +125 c storage temperature t stg -55 to +150 c electrical characteristics note 1 parameter symbol test conditions min typ max unit reverse stand-off voltage v rwm 5.0 v reverse breakdown voltage v br it = 1ma, pin 5 to pin2 6.0 v reverse leakage current i r v rwm = 5v, t=25c, pin5 to pin2 2 a clamping voltage v c i pp = 1a, 8/20 s, any pin to pin2 15 v clamping voltage v c i pp = 6a, 8/20 s, any pin to pin2 25 v v r = 0v, f = 1mhz, any i/o pin to pin2 2 pf v r = 0v, f = 1mhz , between i/o pins 1 pf v r = 0v, f = 1mhz, pin5to pin2 60 pf junction capacitance c j v r = 2.5v, f = 1mhz, pin5to pin2 40 pf pin2to pin5 40 ns pin2to i/o pin 160 ns reverse recovery time trr pin5to i/o pin 45 ns note 1: i/o pins are pin 1, 3, 4, and 6
________________________________________________________________________ http://www.union-ic.com rev.02 jul.2012 3/6 UM5204EECD typical operating characteristics 0.1 1 10 100 1000 0.01 0.1 1 10 peak pulse power C p pk (kw) pulse duration C t p (s) non-repetitive peak pulse power vs. pulse time 0 12 34 56 0 2 4 6 8 forward voltage C v f (v) forward current C i f (a) waveform parameters: tr=8 s td=20 s forward voltage vs. forward current 0 25 50 75 100 125 150 0 20 40 60 80 100 ambient temperature - t a ( ) power derating curve % of rated power or ipp 10 30 50 70 90 110 0 5 10 15 20 25 30 0 20 40 60 80 100 time (s) pulse waveform percent of ipp 10 30 50 70 90 110 waveform parameters: tr=8 s td=20 s e -t td=i pp /2 0123456 8 12 16 20 24 28 clamping voltage C vc (v) peak pulse current C ipp (a) waveform parameters: tr=8 s td=20 s clamping voltage vs. peak pulse current pin 1, 3, 4, 6 to pin 2 pin 5 to pin 2 0 123 45 0 0.5 1 1.5 2 2.5 capacitance C c j (pf) reverse voltage C v r (v) junction capacitance vs. reverse voltage 3 f=1mhz any i/o pin to pin2
________________________________________________________________________ http://www.union-ic.com rev.02 jul.2012 4/6 UM5204EECD applications information device connection options for protectio n of four high-speed data lines this device is designed to protect data lines by clamping them to a fixed reference. when the voltage on the protected line exceeds the referenc e voltage the steering diodes are forward biased, conducting the transient current away from the sensitiv e circuitry. data lines are connected at pins 1, 3, 4 and 6. pin 2 should be connected directly to a ground plane. the path length is kept as short as possible to minimize parasitic inductance. the positive reference is connected at pin 5. the options for connecting the positive reference are as follows: 1. to protect data lines and the power line, conn ect pin 5 directly to the positive supply rail (vcc). in this configuration the data lines are referenc ed to the supply voltage. the internal tvs diode prevents over-voltage on the supply rail. 2. in applications where the supply rail does not exit the system, the internal tvs may be used as the reference. in this case, pin 5 is not connect ed. the steering diodes will begin to conduct when the voltage on the protected lin e exceeds the working voltage of the tvs (plus one diode drop). 3. in applications where complete supply isolation is desired, the internal tvs is again used as the reference and vcc is connected to one of the i/o inputs. an example of this configuration is the protection of a sim port. the clock, reset, i/o, and vcc lines are connected at pins 1, 3, 4, and 6. pin 2 is connected to ground and pin 5 is not connected. protection of four data lines and power supply line protection of four data lines using internal tvs diode as reference matte tin lead finish matte tin has become the industry standard lead-fr ee replacement for snpb lead finishes. a matte tin finish is composed of 100% tin solder with large grains. since the solder volume on the leads is small compared to the solder paste volume th at is placed on the land pattern of the pcb, the reflow profile will be determined by the requireme nts of the solder paste. therefore, these devices are compatible with both lead-free and snpb assembly techniques. in addition, unlike other lead-free compositions, matte tin does not have any a dded alloys that can cause degradation of the solder joint.
________________________________________________________________________ http://www.union-ic.com rev.02 jul.2012 5/6 UM5204EECD package information UM5204EECD tsop-6/sot23-6 outline drawing dimensions millimeters inches symbol min max min max a 1.050 1.250 0.041 0.049 a1 0.000 0.100 0.000 0.004 a2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 d 2.820 3.020 0.111 0.119 e 1.500 1.700 0.059 0.067 e1 2.650 2.950 0.104 0.116 e 0.950ref 0.037ref e1 1.800 2.000 0.071 0.079 l 0.600ref 0.023ref l1 0.300 0.600 0.012 0.024 0 8 0 8 land pattern notes: 1. compound dimension: 2.921.60; 2. unit: mm; 3. general tolerance 0.05mm unless otherwise specified; 4. the layout is just for reference. tape and reel orientation
________________________________________________________________________ http://www.union-ic.com rev.02 jul.2012 6/6 UM5204EECD important notice the information in this docume nt has been carefully review ed and is believed to be accurate. nonetheless, this do cument is subject to change without notice. union assumes no responsibility for an y inaccuracies that may be contai ned in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. union re serves the right to ma ke changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. union semiconductor, inc add: 2f, no. 3, lane 647 songtao road, shanghai 201203 tel: 021-51093966 fax: 021-51026018 website: www.union-ic.com
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