1. 2. 3. material content data sheet sales product name bsb165n15nz3 g issued 3. september 2015 ma# ma001355610 package mg-wdson-2-9 weight* 86.37 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.356 7.36 7.36 73594 73594 leadframe non noble metal copper 7440-50-8 74.415 86.17 86.17 861570 861570 leadfinish non noble metal nickel 7440-02-0 0.211 0.24 2445 noble metal silver 7440-22-4 0.840 0.97 1.21 9725 12170 plating non noble metal nickel 7440-02-0 0.211 0.24 0.24 2445 2445 glue plastics epoxy resin - 0.254 0.29 2942 noble metal silver 7440-22-4 1.561 1.81 2.10 18071 21013 solder non noble metal copper 7440-50-8 0.011 0.01 127 noble metal silver 7440-22-4 0.066 0.08 763 non noble metal tin 7440-31-5 2.119 2.45 2.54 24528 25418 passivation plastics epoxy resin - 0.327 0.38 0.38 3790 3790 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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