1. 2. 3. material content data sheet sales product name bby 55-02v h6327 issued 29. august 2013 ma# MA000787824 package pg-sc79-2-1 weight* 1.68 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 24 noble metal gold 7440-57-5 0.004 0.23 2331 inorganic material silicon 7440-21-3 0.033 1.99 2.22 19908 22263 leadframe inorganic material silicon 7440-21-3 0.000 0.01 92 non noble metal titanium 7440-32-6 0.001 0.05 459 non noble metal chromium 7440-47-3 0.002 0.14 1377 non noble metal copper 7440-50-8 0.767 45.72 45.92 457276 459204 wire non noble metal copper 7440-50-8 0.007 0.42 0.42 4154 4154 encapsulation organic material carbon black 1333-86-4 0.007 0.43 4292 plastics epoxy resin - 0.122 7.30 72971 inorganic material silicondioxide 60676-86-0 0.591 35.20 42.93 351976 429239 leadfinish non noble metal tin 7440-31-5 0.055 3.25 3.25 32527 32527 plating noble metal silver 7440-22-4 0.088 5.26 5.26 52613 52613 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
