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prepared by: date: specno. dg996036 suln/to/?q issue j&16/99 r- uq.ds. page 10 pages approved by: date: electromc components group representative division: < un j- lik e5 sharp corporation .t qkj7~s-e specification opto-electronic devices division device specification for light emitting diode model no. 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharps consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; l * oa equipment * audio visual equipment * home appliance * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers i if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability . and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; [ * transportanon control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment i (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; i * space equipment * telecommunication equipment (for trunk lines) * nuclear power control equipment * medical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. date: customers approval presented by: m.katoh, i date: department general lmanager of engineering dept.,iii opto-electronic devices division by: electronic components group sharp corpolution
dg996036 jun/16/99 model no. page GL5ZJ43 l/10 glszr43 sneeification 1. application this specifkation applies to the light emitting diode device model no. gl5z43. [algainp (dicing or scrilxylxake type> grange led device] 2. outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 3-4. 3-l. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating curve 3-4. characteristics diagram 4. reliability . . . . . . . . . . ..*.......................................... refer to the attached sheet page 5. 4- 1. test items and test conditions 4-2. measurement items and failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 6. 5- 1. applied standard 5-2. sampling method and level 5-3. test items, judgement criteria and classilica of defect 5-4. test items the surface is be applied for flat type, judgement criteria and classilica of defect 6. supplement . . . . . . ..*..................*.......................... refer to the attached sheet page 7-8. 6-l. packing 6-2. luminous intensity rank 6-3. dominant wavelength rank 64. environment 7. precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 9- 10. 7- 1. lead forming method 7-2. notice of installation 7-3. soldering conditions .74. for cleaning
2. outline dimensions aad pin co~ections colorless transparency \ pin comections 0. anode 0. cathode rote) unspecif!ed tol. to be ~0.2mm rote) cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. . . unit mm material lead : (fe) cold rolled steel package : epoxy resin finish lead : sn plated or wave soldering drawing no. 51106017
dg996036 model no. GL5ZJ43 jun/16/% page 3/10 3. ratings and characteristics (note 1) duty ratio=l/lo,pulse width=qlms (note 2) at the position of 1.6mm from the bottom resin package (note 3) refer to the suplement item 6. regarding the standard of rank classification. 3-3. derating curve peak forward current derating curve forward current derating curve 120 a s e 100 - g 80 z 2 60 -0 5 40 2 ,? 20 m d 0? ? i i i -25 0 25 50 75 ??io 125 60 -25 0 25 50 7585 100 125 ambient temperature ta(w ambient temperature ta (%i
dg996036 model no. jud16/9!3 page i GL5ZJ43 i 4/10 peak forward current vs. duty ratio 10 l/100 l/10 1 10 duty raito dr 3-4. characteristics diagram&p) (note 1) forward current vs.forward voltage (ta=25"c) relative luminous intensity vs. ambient temperature ( i f=2omn loo 0. 1 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 forward voltage vfoj) relative luminous intensity vs. frorard voltap~ 1000 5 .- t 100 g 10 >? .- z 0. 1 g p: 0. 01 (ta+x'c) 1000 : l-00 o- ee j a : .- c, 5 2 10 i i i i i i iiii??iiiitlltrll i i i i -60 -40 -20 0 20 40 60 80 100 120 ambient temprature tarc)_ 0. 1 1 10 100 forward current ifha) (note 1) above characteristic data are typical data and not a guarantteed data.
dg996036 jun/16/99 model no. page GL5ZJ43 5110 4. reliability the reliability of products shall be satisfied with items listed below. ll. test items and test conditions test items test conditions solderability 23025c. 5s prior disposition : dip in rosin flux soldering temperature 260t5?c. 5s mechanical shock 15 0oom/s*, 0.5ms. 3times f ix+y&z direction variable frequency 2oom/s*, 100 to 2 0oo to looh&weep for 4min. vibration ,4timesffx,*yfi direction terminal strength (tension) weight: 1on. ss/each terminal terminal strength weight:sn,o? + 9o? + o?* -90? + 0? (bending) /each terminal temperature cycling -4o?c(3omin)~+10o?c(3omin),30 cycles high temp. and high humidity storage ta=+6o?c, 9o%rh, t=100oh igh temperature storage ta=lo0?c, t=10ooh ow temperature storage ta=40?c, t=loo0h operation life ta=25@c, irmax, t=loooh *3 cordidence level: 90% samples (n) ltpd defective (c) (%) n=ll. c=o 20 n=ll, c=o 20 n=ll, c=o 20 n=ll, c=o 20 n=ll. c=o 20 n=ll, c=o 20 n=22, c=o 10 n=22, c=o 10 n=22, c=o 10 n=22. c=o 10 n=22, c=o 10 4-2. measurement items and failure judgement criteria *l measurement symbol failure judgement criteria *2 forward voltage vf v, > u.s.l. x 1.2 reverse current ir ir > u.s.l. x 2.0 luminous intensity iv iv > the first stage value x 2.0 or the first stage value x 0.5 > iv z solderability : solder shall be adhere at the area of 95% or more of dipped portion. % terminal strength : package is not destroyed, and terminal is not slack. * 1: measuring condition is in accordance with specification. *2: u.s.l. is shown by upper specification limit. *3: if max.is shown by forward current of absolute maximum ratings.
dg996036 jlln/16/99 model, no. page GL5ZJ43 6110 5. incoming inspection 5-l. applied standard : is0 2859-1 5-2. sampling method and level : a single sampling plannormal inspection level li : aql major defect : 0.065% minor defect : 0.4% 5-3. test items. iudaement criteria and classifica of defect no. test items judgement criteria classifica of defer 1 discomection not emit light 2 position of cutting off rim different from dimension major defect 3 reverse terminal different from dimension 4 outline dimensions not satisfy outline specification 5 characteristics over the limit value of specification at v,, ia, and iv 6 cut off the rim exceed -0.2mm white pint : exceed d 0.3nun (on top view) 7 foreign substance black point : exceed 4 0.3mm (on top view) string form: exceed 3.omm (on top view) 8 scratch exceed 9 0.3mm or o.lmm x l&run (on top view) minor defect 9 void exceed 4 0.3mm (on top view) 10 uneven density of material for scattering extremely uneven density 11 unbalanced center exceed +&25mm from package center 12 burr exceed +0.2mm againstprovided dimension .3 insertion position of terminal insertion position of terminal 5-4. test items the surface is be applied for flat type, judgement criteria and classifica of defect no. test items judgement criteria classifica of defec 14 chapped the surface 15 hollow the surface the surface chapped is striking for see the lamp top the surface hollow is striking for see the lamp top minor defect
dg996036 model no. GL5ZJ43 jun/16/99 page 7/10 6. supplement 6-l. packing 6-l-l. inner package put 25opcs the same luminous intensity rank products into pack and put following label by pack. product weight : 0.28g (one producftyp.) (indication label sample) shipment table part no. GL5ZJ43 + model number cluantity 250 + quantity of products *o cl clclclclo - --- lot no. ka99b19 4- lot number * 0 0 o@ 0 cl-0 t - luminous intensity rank sharp? dominant wavelength rank made in japan + production country 0 production plant code(to be indicated alphabetically) @ support code @ year of production(the last two figures of the year) @ month of production (to be indicated alphabetically with january corresponding to a) @ date of production(ol-3 1) 6-l-2. outer package put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. outer package out line dimension width : 14omm. depth : 225mm, hight : 90mm 6-2luminous intensim rank (note 1) tta=25ac 1 rank q 4 luminous intensity 3417 - 6657 .--- -- ~_ unit condition r s t 4920 - 9586 7085 - 13803 10203 - ( 19877) mcd +2oma (note 1) tolerance:*15% in regard to luminous intensity , the following ranking shall be carried out. however the quantity of each rank shall not be pre scribed. in case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 6-3.dominant wavelength rank (note 2) rank dominant wavelength t 613.5 - 617.0 i unit (ta=25?c) condition u 616.0 - 619.5 v 618.5 - 622.0 run 1~2om4 w 621.0 - 624.5 x 623.5 - 627.0 i-- inote 2) the condition of measurement : the measurement of the light emission from the front side of lamp. this rank value is the setting value of when that classifies it the rank and be not a guarantee value. also i shall not ask the delivery ratio of each rank.
dg!n6036 junt16l99 model no. page GL5ZJ43 8110 64 environment 641. ozonosphere destructive chemicals. (1) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires following substance. restricted part: cfcsjlalonestccl,trichloroethane(methych 642. bromic non-burning materials the device doesn?t contain bromic non-burning materia.ls(pbbos~bbs)
i GL5ZJ43 9110 7. pncaurions for use 7 - 1. lead forming method avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. lead pins should be formed before soldering. 7 - 2. notice of installation 7-2-l installation on a p w b vhen mounting an led lamp on a pvb,do not apply physical stress to the lead pins. *the lead pin pitch should match the pyb pin-hole pitch:absolutely avoid widening or narrowing the lead pins. l vhen positioning an led lamp,basically employ an led with tie-bar cut or use a spacer. 7-2-2 vhen an led 1 is mounted directly on a p w b if the bottom face of an led lamp is mounted directly on single-sided pm, the base of the lead pins may be subjected to physical stress due to pib warpcutting or clinching of lead pins. prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc.,is found-when an led lamp is mounted on a double-sided pyb,the heat during soldering affects the resin;therefore,keep the led lamp more that 1.61~s~ afloat above the pvb. 7-2-3 installation using a holder during an led lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (note)pay attention to the thermal expansion coefficient of the material used for the holder.since the holder expands and contracts due to preheat and soldering heat,mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 installation to the case do not fix part c with adhesives when fixed to the case as shown in figure-a hole of the case should be designed not to subject the inside of resin to any undue stress. ix996036 junl16/99 model, no. page ng good
dg996036 junllww model no. page GL5ZJ43 lo/lo 7 - 3. soldering conditions ? solder the lead pins under the following conditions type of s oldering conditions 1. manual soldering 29%+5?c. within 3 seconds 2. wave soldering 26o?ck5?c, within 5 seconds 3. auto soldering preheating 70c to 8o?c, within 30 seconds soldering 245?c+5?c, within 5 seconds (note) avoid dipping resin into soldering bath avoid applying stress to lead pins while they are heated. for example , when the led lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. 7 - 4. for cleaning ( 1) solvent cleaning : solvent temperature 45c or less immersion for 3 min or less (2 > ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,pw size or device mounting condition etc. please test it in actual using condition and confirm that doesn?t occur any defect before starting the ultrasonic cleaning. ( 3 > applicable solvent : ethyl alcohol, yethyl alcohol, isopropyl alcohol in case when the other solvent is used,there are cases that the packaging resin is eroded. please use the other solvent after thorough confirmation is performed in actual using condition.

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