crystal oscillator copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 1 anpec reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. pin assignment features general description the apv2002 is a cmos ic that integrates all cir- cuit components required for a oscillator. it is a low cost, low jitter, high performance oscillator, which consists of low-current oscillator circuit and output buffer. the ic also incorporates a high-precision, thin- film feedback resistor and load capacitors with ex- cellent frequency characteristics. it also offers fre- quency divider for application flexibility choice. xtb s0 xt s1 gnd oe vdd qo apv2002 1 2 3 4 8 7 6 5 sop ? 8 ? single chip xo ? up to 60mhz square wave ? ? ? ? ? load capacitors build-in ? ? ? ? ? feedback resistor build-in ? ? ? ? ? 3-state output ? ? ? ? ? high reliability ? cmos/ttl input level ? cmos/ttl output duty level ? ? ? ? ? fundamental oscillator ? ? ? ? ? frequency divider build-in ? ? ? ? ? 2.7v to 5.5v supply voltage ? ? ? ? ? high stability against noise on vdd ? ? ? ? ? chip form and sop-8 package available ordering information apv2002 handling code temp. range package code package code k : sop-8 y : chip form temp. range i : -40 to 85c handling code tu : tube ty : tray tr : tape & reel w : wafer
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 2 apv2002 symbol parameter test condition min. typ . max. unit operating condition vdd supply voltage 4.5 5 5.5 v ambient temperature -40 85 c dc characteristics freq crystal frequency 0.5 60 mhz idd operating current crystal 50mhz , c l = 50pf 20 ma v in input voltage -0.5 v dd +0.5v v out output voltage -0.5 v dd +0.5v ac characteristics duty waveform symmetry 40 50 60 % tr rise time 0.5v to 4.5v , c l = 50pf 3 ns tf fall time 4.5v to 0.5v , c l = 50pf 3 ns electrical characteristics pin symbol function 1 xtb crystal drive 2 s0 (note1) frequency select pin1 3 s1 frequency select pin2 4 gnd ground 5 qo frequency output 6 vdd power 7 oe (note2) output enable 8 xt crystal feedback note1 : please refer frequency selector note2 : high or no connection : enable , low : disable pin description the following specifications apply for v dd = 5v unless otherwise noted.
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 3 electrical characteristics (cont.) apv2002 symbol parameter test condition min. typ . max. unit operating condition vdd supply voltage 3.0 3.3 3.6 v ambient temperature -40 85 dc characteristics freq crystal frequency 0.5 60 mhz idd operating current crystal 55mhz , c l = 50pf 20 ma v in input voltage -0.5 v dd +0.5v v out output voltage -0.5 v dd +0.5v ac characteristics duty waveform symmetry 40 50 60 % tr rise time 0.3v to 3.0v , c l = 50pf 3 ns tf fall time 3.0v to 0.3v , c l = 50pf 3 ns the following specifications apply for v dd = 3.3v unless otherwise noted.
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 4 pad layout pad # symbol description 1 xtb crystal drive 2 oe output enable 3 s0 frequency select pad1 4 s1 frequency select pad2 5 gnd ground 6 c/t (note3) duty cycle modulation 7 qo frequency output 8 nc (note4) reserve 9 vdd power 10 oe output enable 11 xt crystal feedback note3 : c/t-no connection or connect to vdd for above 30meg xo; connect to gnd for below 30meg xo. note4 : nc-no connection 2 1 3 4 5 6 11 10 7 8 9 frequency selector s1 s0 qo x x default xo 2 ox 4 oo 8 note5 : x-no connection , o-connect to gnd note6 : this function for die use only pad description
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 5 2 1 3 4 5 6 11 10 7 8 9 (0,0) x y pad center pad # symbol x(um) y(um) 1 xtb 260 743 2 oepad 78 700 3 s0pad 78 531 4 s1pad 78 359 5 gnd 225,321 78,78 6 tcbpad 468 78 7 qo 638 163 8 nc 638 356 9 vdd 638,638 457,553 10 oepad 638 700 11 xt 449 743 note7 : substrate should be connected to gnd. note8 : vdd and gnd are double pads. die size = 716.5um * 821.5um pad size = 86um * 86um die thickness = 250um pad position
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 6 packaging information millimeters inches dim min. max. min. max. a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 d 4.80 5.00 0.189 0.197 e 3.80 4.00 0.150 0.157 h 5.80 6.20 0.228 0.244 l 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27bsc 0.50bsc 18 8 h e e1 e2 0.015x45 d a a1 0.004max. 1 l sop-8 pin ( reference jedec registration ms-012)
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 7 reference jedec standard j-std-020a april 1999 reflow condition (ir/convection or vpr reflow) physical specifications pre-heat temperature 183 c peak temperature time temperature classification reflow profiles convection or ir/ convection vpr average ramp-up rate(183 c to peak) 3 c/second max. 10 c /second max. preheat temperature 125 25 c) 120 seconds max temperature maintained above 183 c 60 ? 150 seconds time within 5 c of actual peak temperature 10 ?20 seconds 60 seconds peak temperature range 220 +5/-0 c or 235 +5/-0 c 215-219 c or 235 +5/-0 c ramp-down rate 6 c /second max. 10 c /second max. time 25 c to peak temperature 6 minutes max. package reflow conditions pkg. thickness 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume 350 mm3 pkg. thickness < 2.5mm and pkg. volume < 350mm3 convection 220 +5/-0 c convection 235 +5/-0 c vpr 215-219 c vpr 235 +5/-0 c ir/convection 220 +5/-0 c ir/convection 235 +5/-0 c terminal material solder-plated copper (solder material : 90/10 or 63/37 snpb) lead solderability meets eia specification rsi86-91, ansi/j-std-002 category 3.
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 8 carrier tape a j b t2 t1 c t ao e w po p ko bo d1 d f p1 a pp lication a b c j t1 t2 w p e 330 1 62 +1.5 12.75+ 0.15 2 0.5 12.4 0.2 2 0.2 12 0. 3 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t sop- 8 5.5 1 1.55 +0.1 1.55+ 0.25 4.0 0.1 2.0 0.1 6.4 0.1 5.2 0. 1 2.1 0.1 0.3 0.013 test item method description solderability mil-std-883d-2003 245c,5 sec holt mil-std 883d-1005.7 1000 hrs bias @ 125c pct jesd-22-b, a102 168 hrs, 100% rh, 121c tst mil-std 883d-1011.9 -65c ~ 150c, 200 cycles reliability test program
copyright ? anpec electronics corp. rev. a.3 - nov., 2002 apv2002 www.anpec.com.tw 9 customer service anpec electronics corp. head office : 5f, no. 2 li-hsin road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 7f, no. 137, lane 235, pac chiao rd., hsin tien city, taipei hsien, taiwan, r. o. c. tel : 886-2-89191368 fax : 886-2-89191369 cover tape dimensions application carrier width cover tape width devices per reel sop- 8 12 9.3 2500
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