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power management & multimarket data sheet revision 1.2, 2014-05-14 final ESD113-B1 series bi-directional, 3.6 v, 0.2 pf, 0201, 04 02, rohs and ha logen free compliant ESD113-B1-02els ESD113-B1-02el protection device tvs (transient voltage suppressor)
edition 2014-05-14 published by infineon technologies ag 81726 munich, germany ? 2014 infineon technologies ag all rights reserved. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ) warnings due to technical requirements, components may contain dangerous substances. for in formation on the types in question, please contact the neares t infineon technologies office. infineon technologies components may be used in life-suppo rt devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or sys tem. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if t hey fail, it is reasonable to assume that the health of the user or other persons may be endangered.
ESD113-B1 series product overview final data sheet 3 revision 1.2, 2014-05-14 1 product overview 1.1 features ? esd / transient protection of high speed data lines according to: ? iec61000-4-2 (esd): 20 kv (air / contact) ? iec61000-4-4 (eft): 2.5 kv / 50 a (5/50 ns) ? iec61000-4-5 (surge): 3 a (8/20 s) ? bi-directional, work ing voltage up to: v rwm = 3.6 v ? ultra low capacitance c l = 0.20 pf (typical) at f =1ghz ? very low clamping voltage: v cl =14v (typical) at i tlp =16a ? very low reverse current. i r <1na (typical) ? very low dynamic resistance: r dyn =0.45 ? (typical) ? pb-free and halogen-free package (rohs compliant) 1.2 application examples ? usb 3.0, firewire, dvi, hdmi , s-ata, displayport, thunderbolt ? mobile hdmi link, mddi, mipi, swp / nfc 1.3 product description figure 1-1 pin configurati on and schematic diagram table 1-1 part information type package configuration marking code ESD113-B1-02els tsslp-2-4 1 line, bi-directional 2 ESD113-B1-02el tslp-2-20 1 line, bi-directional cc pinconf_and_schematicdiag.vsd pin 1 pin 2 pin 1 pin 2 pin 1 marking (lasered)
ESD113-B1 series maximum ratings final data sheet 4 revision 1.2, 2014-05-14 2 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible dama ge to the component. 3 electrical characteristics at t a = 25 c, unless otherwise specified figure 3-1 definitions of electrical characteristics table 2-1 maximum rating at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit esd air discharge 2) esd contact discharge 2) 2) v esd according to iec61000-4-2 v esd 20 20 kv peak pulse power p pk 36 w peak pulse current 3) 3) non-repetitive current pulse 8/20 s exponential decay waveform according to iec61000-4-5 i pp 3 a operating temperature t op -55 to 125 c storage temperature t stg -65 to 150 c

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ESD113-B1 series electrical characteristics at t a = 25 c, unless otherwise specified final data sheet 5 revision 1.2, 2014-05-14 table 3-1 dc characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. reverse working voltage v rwm -3.6 ? 3.6 v trigger voltage v t1 4?? holding voltage v h 44.65.5 i t =10ma reverse leakage current i r ?<120na v r =3.3v table 3-2 ac characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. line capacitance c l ? 0.2 0.35 pf v r =0v, f =1mhz ?0.2? v r =0v, f =1ghz series inductance l s ? ? 0.2 0.4 ? ? nh ESD113-B1-02els ESD113-B1-02el table 3-3 esd and surge characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. clamping voltage 2) 2) please refer to application note an210 [1] .tlp parameter: z 0 = 50 , t p = 100ns, t r = 300ps. v cl ?14?v i tlp =16a, t p = 100 ns ?20? i tlp =30a, t p = 100 ns clamping voltage 3) 3) non-repetitive current pulse 8/20s exponent ial decay waveform according to iec61000-4-5 ?6? i pp =1a, t p =8/20 s ?8? i pp =3a, t p =8/20 s dynamic resistance 2) r dyn ?0.45? t p = 100 ns
ESD113-B1 series typical characteristics diagrams final data sheet 6 revision 1.2, 2014-05-14 4 typical characteristics diagrams typical characteristics diagrams at t a =25c, unless otherwise specified figure 4-1 reverse leakage current i r =f( v r ) figure 4-2 line capacitance c l =f( v r ) 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 -4 -3 -2 -1 0 1 2 3 4 i r [a] v r [v] 0 0.1 0.2 0.3 0.4 0.5 0.6 -4 -3 -2 -1 0 1 2 3 4 c l [pf] v r [v] 1 mhz 1 ghz
ESD113-B1 series typical characteristics diagrams final data sheet 7 revision 1.2, 2014-05-14 figure 4-3 line capacitance: c l = f (f), v r =0v figure 4-4 insertion loss vs. frequency in a 50 ? system 0 0.1 0.2 0.3 0.4 0.5 0 1 2 3 4 5 6 7 8 9 10 c l [pf] f [ghz] v r = 0 v -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0 1 2 3 4 5 6 7 8 9 10 s 21 [db] f [ghz] v r = 0 v
ESD113-B1 series typical characteristics diagrams final data sheet 8 revision 1.2, 2014-05-14 figure 4-5 clamping voltage (esd): v cl = f ( t ), 8 kv positiv pulse from pin 1 to pin 2 figure 4-6 clamping voltage (esd): v cl = f ( t ), 8 kv negativ pulse from pin 1 to pin 2 -50 -25 0 25 50 75 100 125 150 175 200 0 100 200 300 400 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 134 v v cl-30ns-peak = 12 v -200 -175 -150 -125 -100 -75 -50 -25 0 25 50 0 100 200 300 400 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -134 v v cl-30ns-peak = -12 v
ESD113-B1 series typical characteristics diagrams final data sheet 9 revision 1.2, 2014-05-14 figure 4-7 clamping voltage (esd): v cl = f ( t ), 15 kv positiv pulse from pin 1 to pin 2 figure 4-8 clamping voltage (esd): v cl = f ( t ), 15 kv negativ pulse from pin 1 to pin 2 -50 -25 0 25 50 75 100 125 150 175 200 0 100 200 300 400 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 182 v v cl-30ns-peak = 18 v -200 -175 -150 -125 -100 -75 -50 -25 0 25 50 0 100 200 300 400 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -179 v v cl-30ns-peak = -18 v
ESD113-B1 series typical characteristics diagrams final data sheet 10 revision 1.2, 2014-05-14 figure 4-9 clamping voltage (tlp): i tlp = f ( v tlp ) [1] , pin 1 to pin 2 -40 -30 -20 -10 0 10 20 30 40 -40 -30 -20 -10 0 10 20 30 40 -20 -15 -10 -5 0 5 10 15 20 i tlp [a] equivalent v iec [kv] v tlp [v] ESD113-B1 series r dyn r dyn = 0.45 r dyn = 0.45
ESD113-B1 series typical characteristics diagrams final data sheet 11 revision 1.2, 2014-05-14 figure 4-10 clamping voltage (surge): i pp = f ( v cl ) [1] , pin 1 to pin 2 -4 -3 -2 -1 0 1 2 3 4 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 i pp [a] v cl [v]
ESD113-B1 series package information final data sheet 12 revision 1.2, 2014-05-14 5 package information 5.1 tsslp-2-4 figure 5-1 tsslp-2-4 package outline (dimension in mm) figure 5-2 tsslp-2-4 footprint (dimension in mm) figure 5-3 tsslp-2-4 packing (dimension in mm) figure 5-4 tsslp-2-4 marking example table 1-1 ?part information? on page 3 tsslp-2-3, -4-po v01 0.05 0.32 1 2 0.035 0.2 1) 0.62 0.05 +0.01 0.31 -0.02 1) dimension applies to plated terminals pin 1 marking 1) 0.035 0.26 0.05 max. bottom view top view 0.355 0.27 0.19 0.19 0.19 copper solder mask stencil apertures 0.57 0.24 0.62 0.32 0.24 0.14 tsslp-2-3, -4-fp v02 tsslp-2-3, -4-tp v03 deliveries can be both tape types (no selection possible). specification allows identical processing (pick & place) by users. ex ey punched tape tape type embossed tape 0.43 0.73 0.37 0.67 ex 4 ey 0.35 pin 1 marking 8 tsslp- 2 - 3 , -4 -mk v 01 pin 1 marking 1 type code
ESD113-B1 series package information final data sheet 13 revision 1.2, 2014-05-14 5.2 tslp-2-20 figure 5-5 tslp-2-20 package outline (dimension in mm) figure 5-6 tslp-2-20 footprint (dimension in mm) figure 5-7 tslp-2-20 packing (dimension in mm) figure 5-8 tsslp-2-4 marking example table 1-1 ?part information? on page 3 0.05 0.6 1 2 0.05 0.65 0.035 0.25 1) 1 0.05 0.05 max. +0.01 0.31 -0.02 1) dimension applies to plated terminals pin 1 marking 1) 0.035 0.5 bottom view top view tslp-2-19, -20-fp v01 0.45 0.28 0.28 0.38 0.93 copper solder mask stencil apertures 0.35 1 0.6 0.35 0.3 0.76 4 1.16 0.4 pin 1 marking 8 tslp-2-19, -20-tp v02 type code pin 1 marking tslp-2-19, -20-mk v01 12
ESD113-B1 series references final data sheet 14 revision 1.2, 2014-05-14 references [1] infineon ag - application note an210: effective esd protection design at system level using vf-tlp characterization methodology [2] infineon ag - recommendations for pcb a ssembly of infineon tslp and tsslp package
ESD113-B1 series final data sheet 15 revision 1.2, 2014-05-14 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pr o-sil?, profet?, rasic?, re versave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlew is?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 revision history: rev.1.1, 2013-02-06 page or item subjects (major changes since previous revision) revision 1.2, 2014-05-14 all new type ESD113-B1-02el inserted
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