part number: XZMOKT53W-6 1.6x0.8x0.25mm (0603) smd chip led lamp jan 06,2017 xdsb2081 v6-x layout: maggie l. p. 1/4 features ideal for indication light on hand held products long life and robust package standard package: 4,000pcs/ reel msl (moisture sensitivity level): 3 rohs compliant absolute maximum ratings (t a =25c) orange (algainp) unit reverse voltage v r 5 v forward current i f 30 ma forward current (peak) 1/10 duty cycle 0.1ms pulse width i fs 150 ma power dissipation p d 75 mw operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 package schematics notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1(0.004") unless otherwise noted. 3. specifications are subjec t to change without notice. orange (algainp) unit forward voltage (typ.) (i f =20ma) v f 2.05 v forward voltage (max.) (i f =20ma) v f 2.5 v reverse current (max.) (v r =5v) i r 10 ua wavelength of peak emission cie127-2007*(typ.) (i f =20ma) p 610* nm wavelength of dominant emission cie127-2007*(typ.) (i f =20ma) d 601* nm spectral line full width at half-maximum (typ.) (i f =20ma) 17 nm capacitance (typ.) (v f =0v, f=1mhz) c 15 pf operating characteristics (t a =25c) part number emitting color emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZMOKT53W-6 orange algainp water clear 120 55* 297 98* 610* 120 luminous intensity cie127-2007* (i f =20ma) mcd *luminous intensity value and wavelength are in accordance with cie127-2007 standards. applications 1.mobile phone keypad indicator and backlight 2.flat backlight for lcd, switch and symbol 3.toys attention observe precautions for handling electrostatic discharge sensitive devices a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033)
part number: XZMOKT53W-6 1.6x0.8x0.25mm (0603) smd chip led lamp jan 06,2017 xdsb2081 v6-x layout: maggie l. p. 2/4 ? orange led is recommended for reflow soldering and soldering profile is shown below. 0% 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 t a = 25 c orange wavelength (nm) relative radiant intensity relative intensity vs. cie wavelength
part number: XZMOKT53W-6 1.6x0.8x0.25mm (0603) smd chip led lamp jan 06,2017 xdsb2081 v6-x layout: maggie l. p. 3/4 ? the device has a single mounting surface. the device must be mounted according to the specifications. ? reel dimension ? recommended soldering pattern (units : mm; tolerance: 0.1) ? tape specification (units : mm) remarks: if special sorting is required (e.g. binn ing based on forward voltage, luminous intensity / luminous flux, or wavelength), the typical accuracy of the so rting process is as follows: 1. wavelength: +/-1nm 2. luminous intensity / luminous flux: +/-15% 3. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters. m ask open area ratio:80% mask thickness:80~100um
part number: XZMOKT53W-6 1.6x0.8x0.25mm (0603) smd chip led lamp jan 06,2017 xdsb2081 v6-x layout: maggie l. p. 4/4 packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp
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