? semiconductor components industries, llc, 2013 january, 2013 ? rev. 3 1 publication order number: esd9c3.3s/d esd9c3.3st5g series transient voltage suppressors micro ? packaged diodes for esd protection the esd9c3.3st5g series is designed to protect voltage sensitive components from esd. excellent clamping capability, low leakage, and fast response time make these parts ideal for esd protection on designs where board space is at a premium. because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. specification features: ? low capacitance 6.2 pf ? 13 pf ? low clamping voltage ? small body outline dimensions: 0.039 x 0.024 (1.0 mm x 0.60 mm) ? low body height: 0.016 (0.40 mm) max ? stand ? off voltage: 3.3 v, 5 v ? low leakage ? response time < 1 ns ? esd rating of class 3 (> 16 kv) per human body model ? iec61000 ? 4 ? 2 level 4 esd protection ? aec ? q101 qualified and ppap capable ? these are pb ? free devices mechanical characteristics: case: void-free, transfer-molded, thermosetting plastic epoxy meets ul 94 v ? 0 lead finish: 100% matte sn (tin) mounting position: any qualified max reflow temperature: 260 c device meets msl 1 requirements maximum ratings rating symbol value unit iec 61000 ? 4 ? 2 (esd) contact air 8.0 15 kv total power dissipation on fr ? 5 board (note 1) @ t a = 25 c ? p d 150 mw junction and storage temperature range t j , t stg ? 55 to +150 c lead solder temperature ? maximum (10 second duration) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. fr ? 5 = 1.0 x 0.75 x 0.62 in. see application note and8308/d for further description of survivability specs. device package shipping ? ordering information esd9cxxst5g sod ? 923 (pb ? free) 8000/tape & reel marking diagram see specific marking information in the device marking column of the table on page 2 of this data sheet. device marking information http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. sod ? 923 case 514ab x = specific device code m = date code 12 pin 1. cathode 2. anode x m
esd9c3.3st5g series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current i f forward current v f forward voltage @ i f p pk peak power dissipation c max. capacitance @v r = 0 and f = 1 mhz *see application note and8308/d for detailed explanations of datasheet parameters. uni ? directional tvs i pp i f v i i r i t v rwm v c v br v f electrical characteristics (t a = 25 c unless otherwise noted, v f = 1.1 v max. @ i f = 10 ma) device device marking v rwm (v) i r ( a) @ v rwm v br (v) @ i t (note 2) i t c (pf) (note 3) c (pf) (note 3) v c max max min ma typ max per iec61000 ? 4 ? 2 (note 4) esd9c3.3st5g r 3.3 1.0 5.0 1.0 12.8 13 figures 1 and 2 see below (note 5) esd9c5.0st5g p 5.0 0.5 11.0 1.0 6.0 6.2 2. v br is measured with a pulse test current i t at an ambient temperature of 25 c. 3. capacitance at f = 1 mhz, v r = 0 v, t a = 25 c. 4. for test procedure see figures 3 and 4 and application note and8307/d. 5. esd9c5.0st5g shown below. other voltages available upon request. figure 1. esd clamping voltage screenshot positive 8 kv contact per iec61000 ? 4 ? 2 figure 2. esd clamping voltage screenshot negative 8 kv contact per iec61000 ? 4 ? 2
esd9c3.3st5g series http://onsemi.com 3 iec 61000 ? 4 ? 2 spec. level test voltage (kv) first peak current (a) current at 30 ns (a) current at 60 ns (a) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 i peak 90% 10% iec61000 ? 4 ? 2 waveform 100% i @ 30 ns i @ 60 ns t p = 0.7 ns to 1 ns figure 3. iec61000 ? 4 ? 2 spec figure 4. diagram of esd test setup 50 50 cable tvs oscilloscope esd gun the following is taken from application note and8308/d ? interpretation of datasheet parameters for esd devices. esd voltage clamping for sensitive circuit elements it is important to limit the voltage that an ic will be exposed to during an esd event to as low a voltage as possible. the esd clamping voltage is the voltage drop across the esd protection diode during an esd event per the iec61000 ? 4 ? 2 waveform. since the iec61000 ? 4 ? 2 was written as a pass/fail spec for larger systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. on semiconductor has developed a way to examine the entire voltage waveform across the esd protection diode over the time domain of an esd pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all esd protection diodes. for more information on how on semiconductor creates these screenshots and how to interpret them please refer to and8307/d.
esd9c3.3st5g series http://onsemi.com 4 package dimensions sod ? 923 case 514ab issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 d 0.75 0.80 0.85 e 0.55 0.60 0.65 0.95 1.00 1.05 l 0.19 ref h e 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.007 ref min nom max inches d e c a ? y ? ? x ? 2 1 dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* see application note and8455/d for more mounting details 1.20 2x 0.25 2x 0.36 package outline b 2x 0.08 xy top view h e side view 2x bottom view l2 l 2x l2 0.05 0.10 0.15 0.002 0.004 0.006 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 esd9c3.3s/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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