sep 16, 2016 xdsb7583 v5-z layout: maggie p. 1/4 part number: XZMYR68W-3 1.0x0.5x0.2mm (0402) smd chip led lamp features ideal for indication light on hand held products long life and robust package standard package: 4,000pcs/ reel msl (moisture sensitivity level): 3 rohs compliant package schematics notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1(0.004") unless otherwise noted. 3. specifications are subjec t to change without notice. absolute maximum ratings (t a =25c) yellow (algainp) unit reverse voltage v r 5 v forward current i f 25 ma forward current (peak) 1/10 duty cycle 0.1ms pulse width i fs 120 ma power dissipation p d 60 mw operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 operating characteristics (t a =25c) yellow (algainp) unit forward voltage (typ.) (i f =20ma) v f 2.05 v forward voltage (max.) (i f =20ma) v f 2.4 v reverse current (max.) (v r =5v) i r 10 ua wavelength of peak emission cie127-2007*(typ.) (i f =20ma) p 591* nm wavelength of dominant emission cie127-2007*(typ.) (i f =20ma) d 589* nm spectral line full width at half-maximum (typ.) (i f =20ma) 15 nm part number emitting color emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZMYR68W-3 yellow algainp wa ter clear 55* 98* 591* 120 luminous intensity cie127-2007* (i f =20ma) mcd *luminous intensity value and wavelength are in accordance with cie127-2007 standards. a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033) attention observe precautions for handling electrostatic discharge sensitive devices
sep 16, 2016 xdsb7583 v5-z layout: maggie p. 2/4 part number: XZMYR68W-3 1.0x0.5x0.2mm (0402) smd chip led lamp ? yellow led is recommended for reflow soldering and soldering profile is shown below. yellow
sep 16, 2016 xdsb7583 v5-z layout: maggie p. 3/4 part number: XZMYR68W-3 1.0x0.5x0.2mm (0402) smd chip led lamp ? tape specification (units : mm) ? the device has a single mounting surface. the device must be mounted according to ? reel dimension ? recommended soldering pattern (units : mm; tolerance: 0.1) remarks: if special sorting is required (e.g. binn ing based on forward voltage, luminous intensity / luminous flux, or wavelength), the typical accuracy of the so rting process is as follows: 1. wavelength: +/-1nm 2. luminous intensity / luminous flux: +/-15% 3. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters. mask open area ratio:80% mask thickness:80~100um
sep 16, 2016 xdsb7583 v5-z layout: maggie p. 4/4 part number: XZMYR68W-3 1.0x0.5x0.2mm (0402) smd chip led lamp packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp xzxxx68x
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