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this is information on a product in full production. november 2014 docid12360 rev5 1/13 13 STTH4R02 ultrafast recovery diode datasheet ? production data features ? negligible switching losses ? high junction temperature ? very low conduction losses ? low forward and reverse recovery times ? ecopack ? compliant component for dpak on demand description the STTH4R02 uses st's new 200 v planar pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. packaged in dpak, smb and smc, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. 60% . . $ 60& $ . $ $ $ '3$. . . $ $ table 1. device summary symbol value i f(av) 4 a v rrm 200 v v f (typ) 0.76 v t j (max) 175 c t rr (typ) 16 ns www.st.com
characteristics STTH4R02 2/13 docid12360 rev5 1 characteristics to evaluate the conduction losses use the following equation: p = 0.67 x i f(av) + 0.04 i f 2 (rms) table 2. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward rms current dpak 70 a smb, smc i f(av) average forward current, = 0.5, square wave dpak, t c = 160 c 4a smb, smc, t lead = 95 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 70 a t stg storage temperature range -65 to +175 c t j (1) maximum operating temperature 175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case, dpak 3.5 c/w r th(j-l) junction to lead, smb and smc 20 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 3 a t j = 125 c 2 20 v f (2) forward voltage drop t j = 25 c i f = 12a 1.15 1.25 v t j = 25 c i f = 4 a 0.95 1.05 t j = 150 c 0.76 0.83 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid12360 rev5 3/13 STTH4R02 characteristics table 5. dynamic electrical characteristics symbol parameter tests conditions min. typ. max. unit t rr reverse recovery time t j = 25 c i f = 1 a, di f /dt = -50 a/s v r = 30 v 24 30 ns i f = 1 a, di f /dt = -100 a/s v r = 30 v 16 20 i rm reverse recovery current t j = 125 c i f = 4 a, di f /dt = -200 a/s, v r = 160 v 4.4 5.5 a t fr forward recovery time t j = 25 c i f = 4 a, di f /dt = 50 a/s, v fr = 1.1 x v fmax 80 ns v fp forward recovery voltage t j = 25 c i f = 4 a, di f /dt = 50 a/s 1.6 v figure 1. peak current versus duty cycle figure 2. forward voltage drop versus forward current (typical values) / , 0 $ 7 / ws7 ws 3 : 3 : 3 : , )0 $ 7 m ?& 9 )0 9 7 m ?& figure 3. forward voltage drop versus forward current (maximum values) figure 4. relative variation of thermal impedance, junction to case, versus pulse duration , )0 $ 7 m ?& 9 )0 9 7 m ?& ( ( ( ( = wkmf 5 wkmf w 3 v '3$. 6lqjohsxovh
characteristics STTH4R02 4/13 docid12360 rev5 figure 5. relative variation of thermal impedance, junction to ambient, versus pulse duration (smb) figure 6. relative variation of thermal impedance, junction to ambient, versus pulse duration (smc) ( ( ( ( ( = wkmd 5 wkmd w 3 v 60% 6 &8 fpe ( ( ( ( ( = wkmd 5 wkmd w 3 v 60& 6 &8 fpe figure 7. junction capacitance versus reverse applied voltage (typical values) figure 8. reverse recovery charges versus di f /dt (typical values) &s) 9 5 9 ) 0+] 9 26& p9 506 7 m ?& 4 55 q& 7 m ?& go ) gw$?v 7 m ?& , ) $ 9 5 9 figure 9. reverse recovery time versus di f /dt (typical values) figure 10. peak reverse recovery current versus di f /dt (typical values) w 55 qv 7 m ?& go ) gw$?v 7 m ?& , ) $ 9 5 9 , 50 $ 7 m ?& go ) gw$?v 7 m ?& , ) $ 9 5 9
docid12360 rev5 5/13 STTH4R02 characteristics figure 11. dynamic parameters versus junction temperature figure 12. thermal resistance, junction to ambient, versus copper surface under tab 4 55 , 50 >7m@ 4 55 , 50 >7 m ?&@ , 50 go ) gw$?v , ) $ 9 5 9 4 55 5 wkmd ?&: 6 &8 fpe '3$. (sr[\sulqwhgerdug)5frsshuwklfnqhvv ?p figure 13. thermal resistance, junction to ambient, versus copper surface under tab figure 14. thermal resistance, junction to ambient, versus copper surface under tab 5 wkmd ?&: 6 &8 fpe 60% (sr[\sulqwhgerdug)5frsshuwklfnqhvv ?p 5 wkmd ?&: 6 &8 fpe 60& (sr[\sulqwhgerdug)5frsshuwklfnqhvv ?p
package information STTH4R02 6/13 docid12360 rev5 2 package information ? epoxy meets ul94,v0 ? cooling method: by conduction (c) ? lead-free package ? band indicates cathode in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 15. dpak dimension definitions note: this package drawing may slightly differ from the physical package. however, all the specified dimensions are guaranteed. l1 l a1 r r d c a c2 v2 a2 h l4 e1 e b l2 e b4 gauge plane 0.25 d1 d e1 thermal pad
docid12360 rev5 7/13 STTH4R02 package information figure 16. dpak footprint dimensions (in mm) table 6. dpak dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 2.18 2.40 0.085 0.094 a1 0.90 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.01 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.195 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.024 d 5.97 6.22 0.235 0.245 d1 5.10 0.201 e 6.35 6.73 0.250 0.265 e1 4.32 0.170 e1 4.4 4.7 0.173 0.185 h 9.35 10.40 0.368 0.407 l 1.0 1.78 0.039 0.070 l2 1.27 0.05 l4 0.6 1.02 0.024 0.040 v2 0 8 0 8 $ % 7khghylfhp xvw ehsrvlwlrqhgz lwklq $%
package information STTH4R02 8/13 docid12360 rev5 figure 17. smb dimensions definitions table 7. smb dimension values ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 ( / ( ' $ $ e f
docid12360 rev5 9/13 STTH4R02 package information figure 18. smb footprint, dimensions in mm (inches)
package information STTH4R02 10/13 docid12360 rev5 figure 19. smc dimensions definitions table 8. smc dimension values ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b (1) 1. dimensions b and c apply to plated leads 2.90 3.20 0.114 0.126 c (1) 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.50 0.030 0.059 ( / ( ( ' $ $ e f
docid12360 rev5 11/13 STTH4R02 package information figure 20. smc footprint, dimensions in mm (inches)
ordering information STTH4R02 12/13 docid12360 rev5 3 ordering information figure 21. ordering information scheme 4 revision history table 9. ordering information order code marking package weight base qty delivery mode STTH4R02b-tr STTH4R02 dpak 0.32 g 2500 tape and reel STTH4R02u 4r2u smb 0.110 g 2500 tape and reel STTH4R02s 4r2s smc 0.243 g 2500 tape and reel 677+5[[[ 8owudidvwvzlwfklqjglrgh $yhudjhiruzdugfxuuhqw $ 0rgho5 5hshwlwlyhshdnuhyhuvhyrowdjh 9 3dfndjh %75 '3$.lqwdshdqguhho 8 60%lqwdshdqguhho 6 60&lqwdshdqguhho table 10. document revision history date revision changes 03-may-2006 1 first issue. 10-oct-2006 2 added smc package 13-apr-2010 3 updated ecopack statement. updated dimensions tables for smb and smc. 01-jul-2010 4 separated junction to lead values from junction to case values in table 3 . 20-nov-2014 5 removed to-220ac, to-220fpac and do-201ab package informations.
docid12360 rev5 13/13 STTH4R02 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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