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NXP Semiconductors
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| Part No. |
LPC1114JHN33 LPC1114FHI33 LPC1114FHN33 LPC1113FBD48 LPC1113JBD48 LPC1114FBD48 LPC1114JBD48 LPC1115FBD48 LPC1115JBD48 LPC1112FDH20 LPC1114FDH28 LPC1112FDH28 LPC1111FDH20 LPC1115FET48 LPC1115JET48 LPC1114FA44 LPC1112FD20 LPC1113JHN33
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| OCR Text |
...stic small outline pa ckage; 20 leads; body width 7.5 mm sot163-1 lpc1111fdh20/002 tssop20 tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 lpc1112fd20/102 so20 so20: plastic small outline package; ... |
| Description |
32kB flash, 8kB SRAM, HVQFN32 package
24kB flash, 8kB SRAM, LQFP48 package
32kB flash, 8kB SRAM, LQFP48 package
64kB flash, 8kB SRAM, LQFP48 package
16kB flash, 4kB SRAM, TSSOP20 package
32kB flash, 4kB SRAM, TSSOP28 package
16kB flash, 4kB SRAM, TSSOP28 package
8kB flash, 2kB SRAM, TSSOP20 package
64kB flash, 8kB SRAM, TFBGA48 package
32kB flash, 8kB SRAM, PLCC44 package
16kB flash, 4kB SRAM, SO20 package
24kB flash, 8kB SRAM, HVQFN32 package
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| File Size |
2,725.47K /
127 Page |
 View
it Online |
Download Datasheet
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HB[HB Electronic Components]
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| Part No. |
560VW6C
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| OCR Text |
...), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2... |
| Description |
LED SPECIFICATION
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| File Size |
775.80K /
10 Page |
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it Online |
Download Datasheet |
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HB[HB Electronic Components]
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| Part No. |
560PR2C
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| OCR Text |
...d spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 1
HD-R/RD013
5.0 mm
DIA LED
LAMP
REV:A / 0
560PR... |
| Description |
5.0 mm DIA LED LAMP
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| File Size |
314.35K /
8 Page |
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it Online |
Download Datasheet |
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HB[HB Electronic Components]
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| Part No. |
560PB6C
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| OCR Text |
...), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2... |
| Description |
LED SPECIFICATION
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| File Size |
752.26K /
9 Page |
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it Online |
Download Datasheet |
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Vishay Roederstein
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| Part No. |
EKS00AA210HLO
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| OCR Text |
... 4 min. - + 5 ? d 18 long leads eks 00... 5 ? d 18 shortened leads eks 05... (s = 2 / 2.5 / 3.5 / 5 / 7.5 mm) 10 ? d 18 leads shortened and formed eks 06... (s = 5 / 7.5 mm) d max. l max. 4.5 0.5 s
... |
| Description |
EKS - Aluminum Capacitors Radial Style
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| File Size |
119.16K /
7 Page |
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it Online |
Download Datasheet |
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PANASONIC CORP
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| Part No. |
DN8797SE
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| OCR Text |
...f insertion type package if the leads of a hall ic in an insertion type package are inserted up to their root part through holes on the printed circuit board, abnormal stress is applied to the package and the reliability of the hall ic is l... |
| Description |
SPECIALTY ANALOG CIRCUIT, PSIP3
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| File Size |
202.01K /
6 Page |
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it Online |
Download Datasheet |
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HB[HB Electronic Components]
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| Part No. |
560JY8C
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| OCR Text |
...d spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice
DRAWING NO. : DS-35-03-0393
DATE : 2003-06-26
Page : 1
HD-R/RD013
5.0 mm
DIA LED
LAMP
REV:A / 0
560JY... |
| Description |
5.0 mm DIA LED LAMP
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| File Size |
408.00K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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